Novel mask-less plating metallization route for bifacial silicon heterojunction solar cells

Hatt, Thibaud; Mehta, Vivek P.; Bartsch, Jonas; Kluska, Sven; Jahn, Mike; Borchert, D.; Glatthaar, Markus

doi:10.1063/1.5049272

Cited by 14 publications

(18 citation statements)

References 15 publications

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“…Native oxide barrier layer for selective electroplating (NOBLE) metallization was first demonstrated on ITO with SHJ solar cells. [26] Besides low contact resistivity ≤ 1 mΩ cm 2 and high adhesion %3 N mm À1 of the contacts on ITO, simultaneous Cu electroplating on both cell sides drives down the cost for this resist-free metallization [36] and could as well be adapted to bifacial tandem perovskite-SHJ devices, which were shown to be promising for reaching higher energy yield. [37] Copper electrodes were plated on the PSCs for the two scenarios without dissolution of the underlying FA 0.75 Cs 0.25 Pb(I 0.8 Br 0.2 ) 3 perovskite absorber, as shown in Figure 2.…”

Section: Resultsmentioning

confidence: 99%

Electroplated Copper Metal Contacts on Perovskite Solar Cells

et al. 2021

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Electroplated copper contacts on small‐area single‐junction perovskite solar cells (PSCs) using an atomic layer deposited (ALD) Al2O3 masking layer on ITO are demonstrated for the first time. The photoconversion efficiency of ≈11% after manufacturing the Cu contacts confirms that PSCs can survive the wet‐chemical plating process. From the successful realization of plated contact fingers, the creation of an electrical contact between the Cu electrode and the ITO on the FA0.75Cs0.25Pb(I0.8Br0.2)3 perovskite absorber is inferred. Furthermore, scanning electron microscopy (SEM) with energy‐dispersive X‐ray (EDX) analysis shows the formation of a compact interface between ITO and plated Cu. An additional plating approach, using self‐passivated aluminum as mask, allows to produce well‐defined 30 μm wide Cu contacts on the PSC. Such a plating process allows for plating a low‐resistive Cu grid simultaneously on both sides of a perovskite silicon heterojunction tandem solar cell with TCO, independent of substrate size.

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Section: Resultsmentioning

confidence: 99%

Electroplated Copper Metal Contacts on Perovskite Solar Cells

et al. 2021

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“…The Cu deposition is fine‐granular which gives high contact conductivity near the value of the Cu‐bulk. The forward / reverse pulsed current avoids parasitic plating as already described in a previous study where the acidity, composition of the electrolyte and the plating settings were optimized . A thin silver capping is also deposited to prevent Cu from any oxidation.…”

Section: Resultsmentioning

confidence: 99%

“…This patterning step allows to plate Cu selectively onto the metal‐ seed − Figure (3). At this state, the less noble metal Al and the Al 2 O 3 are acting as barrier to inhibit Cu plating in the non‐grid positions as described by Hatt et al A thin silver capping (≈200 nm) follows to protect the Cu‐contacts against oxidation.…”

Section: Approachmentioning

confidence: 99%

“…On the other hand, a plated metallization is intrinsically a low temperature process. Plated approaches using highly conductive and less expensive copper are currently investigated . The Cu‐based contacts can be electroplated simultaneously on both‐sides of the solar cells and TCOs like indium‐tin‐oxide (ITO) are good barrier to metals diffusion into silicon .…”

Section: Introductionmentioning

confidence: 99%

“…An etchant is inkjet‐printed to structure the contact positions in the Al layer. This grid‐patterning method is even cheaper than the deposition of a reactive silver ink onto the aluminum . Only a small area − contact‐grid area <10% of the cell, has to be printed in contrary to the “Resist route” (masking >90% of the cell area).…”

Section: Introductionmentioning

confidence: 99%

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Native Oxide Barrier Layer for Selective Electroplated Metallization of Silicon Heterojunction Solar Cells

et al. 2019

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The metallization of silicon heterojunction (SHJ) solar cells by electroplating of highly conductive copper onto a multifunctional patterned metal layer stack is demonstrated. The approach features several advantages: low temperature processing, high metal conductivity of plated copper, no organic making, and low material costs (almost Ag‐free). A PVD layer stack of copper and aluminum is deposited onto the cell subsequently to TCO deposition. The aluminum layer is patterned with a printed etchant and its native oxide on the remaining areas inhibits plating. The full area aluminum layer while electroplating supports plating current distribution and allows homogeneous plating height distributions over the cell. The NOBLE (native oxide barrier layer for selective electroplating) approach allows reaching a first encouraging SHJ solar cell efficiency of 20.2% with low contact resistivity.

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Controllable Simultaneous Bifacial Cu‐Plating for High‐Efficiency Crystalline Silicon Solar Cells

et al. 2022

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Bifacial (BF) copper‐plated crystalline silicon solar cell is an attractive topic to concurrently reduce silver consumption and maintain good device performance. However, it is still challenging to realize a high aspect ratio (AR) of the metal fingers. Herein, a new type of hybrid‐shaped Cu finger is electromagnetically fabricated in a BF plating process. Cyclic voltammetry is employed to disclose the electrochemical behaviors of cupric ions in monofacial and simultaneous BF Cu‐plating processes, such that the controllability of the plating process could be assessed. The optimal hybrid Cu finger is composed of a rectangular bottom part and a round top part, such that an utmost effective AR value of 1.73 is reached. In BF Cu‐plating, two sub‐three‐electrode electrochemical cells are employed to realize equal metal finger heights on both sides of the wafer. Compared to our low thermal‐budget screen‐printing metallization, the Cu‐plated silicon heterojunction devices show both optical and electrical advantages (based on lab‐scale tests). The champion BF Cu‐plated device shows a front‐side efficiency of 22.1% and a bifaciality factor of 0.99.

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Novel mask-less plating metallization route for bifacial silicon heterojunction solar cells

Cited by 14 publications

References 15 publications

Electroplated Copper Metal Contacts on Perovskite Solar Cells

Electroplated Copper Metal Contacts on Perovskite Solar Cells

Native Oxide Barrier Layer for Selective Electroplated Metallization of Silicon Heterojunction Solar Cells

Controllable Simultaneous Bifacial Cu‐Plating for High‐Efficiency Crystalline Silicon Solar Cells

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