Novel method of alignment to buried cavities in cavity-SOI wafers for advanced MEMS devices

Mountain, Christopher; Kluba, Marta; Bergers, Lijc Lambert; Snijder, J.; Dekker, R.

doi:10.1016/j.mne.2019.100043

Cited by 2 publications

(2 citation statements)

References 18 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The main technical challenge arises from the fact that the submicron (less than 1 µm) alignment accuracy between the buried cavity-BOX mask and the structures on top of the device layer must be guaranteed. To overcome that problem, the alignment marker transferring strategy, proposed and developed by C. Mountain et al [ 11 ], was applied to ensure high precision alignment of the structures. Another goal was to demonstrate the functionality of the pre-patterned BOX mask.…”

Section: Fabricationmentioning

confidence: 99%

“…The high-precision alignment (<500 nm) of the prefabricated cavities with the structures fabricated later, on the device layer, is ensured by applying a newly developed marker transferring strategy. The method uses a set of primary alignment markers, located on the SOI wafer terrace, that are transferred onto the device layer using front-to-front alignment [ 11 ]. The patterned BOX can serve as a stop layer during the device layer thinning, and it can be used as a hard mask during the device layer patterning from the backside.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Cavity-BOX SOI: Advanced Silicon Substrate with Pre-Patterned BOX for Monolithic MEMS Fabrication

Kluba

Parkkinen

et al. 2021

Micromachines

Self Cite

View full text Add to dashboard Cite

Several Silicon on Insulator (SOI) wafer manufacturers are now offering products with customer-defined cavities etched in the handle wafer, which significantly simplifies the fabrication of MEMS devices such as pressure sensors. This paper presents a novel cavity buried oxide (BOX) SOI substrate (cavity-BOX) that contains a patterned BOX layer. The patterned BOX can form a buried microchannels network, or serve as a stop layer and a buried hard-etch mask, to accurately pattern the device layer while etching it from the backside of the wafer using the cleanroom microfabrication compatible tools and methods. The use of the cavity-BOX as a buried hard-etch mask is demonstrated by applying it for the fabrication of a deep brain stimulation (DBS) demonstrator. The demonstrator consists of a large flexible area and precisely defined 80 µm-thick silicon islands wrapped into a 1.4 mm diameter cylinder. With cavity-BOX, the process of thinning and separating the silicon islands was largely simplified and became more robust. This test case illustrates how cavity-BOX wafers can advance the fabrication of various MEMS devices, especially those with complex geometry and added functionality, by enabling more design freedom and easing the optimization of the fabrication process.

show abstract

Section: Fabricationmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Cavity-BOX SOI: Advanced Silicon Substrate with Pre-Patterned BOX for Monolithic MEMS Fabrication

Kluba

Parkkinen

et al. 2021

Micromachines

Self Cite

View full text Add to dashboard Cite

show abstract

A progressive overview of the mainstream additive manufacturing of ceramic components for industrial advancement

Islam,

Sumona,

Haque

et al. 2024

MaterialsOpenRes

View full text Add to dashboard Cite

Additive manufacturing (AM), well-known as 3D printing, has revolutionized traditional manufacturing methods, particularly in the production of ceramic components. These techniques offer unique advantages and challenges in ceramic component production. Developing specific ceramic materials with AM improves the finished products' mechanical, thermal, and electrical characteristics. Integrating artificial intelligence and machine learning shows promise in improving process control and design optimization, spurring innovation and opening previously unimaginable possibilities, although problems such as material shrinkage, microstructural control, and surface polish remain crucial research areas. This review article presents a comprehensive overview of the advancements and applications of AM for ceramic pieces in the industrial sector. This study highlights the fundamental principles of AM, focusing on their difficulties and potential in ceramic fabrication. A comprehensive review of AM will deliver an understanding of its ability to alter industrial manufacturing and open the door to a new era of ceramic fabrication and applications.

show abstract

Novel method of alignment to buried cavities in cavity-SOI wafers for advanced MEMS devices

Cited by 2 publications

References 18 publications

Cavity-BOX SOI: Advanced Silicon Substrate with Pre-Patterned BOX for Monolithic MEMS Fabrication

Cavity-BOX SOI: Advanced Silicon Substrate with Pre-Patterned BOX for Monolithic MEMS Fabrication

A progressive overview of the mainstream additive manufacturing of ceramic components for industrial advancement

Contact Info

Product

Resources

About