2021 IEEE 71st Electronic Components and Technology Conference (ECTC) 2021
DOI: 10.1109/ectc32696.2021.00242
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Novel method of wafer-level and package-level process simulation for warpage optimization of 2.5D TSV

Su Chang Lee
1
,
Sun Woo Han
2
,
Jong Pa Hong
3
et al.
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Cited by 12 publications
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