2006
DOI: 10.1109/tadvp.2005.849547
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Novel Microcontacts in Microwave Chip Carriers Developed by UV-LIGA Process

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Cited by 9 publications
(4 citation statements)
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“…Micromachining due to the high dimensional accuracy and the possibility of achieving high-aspect-ratio structures has the potential for the manufacturing of mm-wave components. Among different micromachining techniques, silicon-based micromachining [ 5 , 6 ], SU8 photoresist-based process [ 7 , 8 , 9 , 10 , 11 ], and LIGA-based thick layer electroplating [ 12 , 13 ] are suitable for manufacturing mm-wave components.…”
Section: Introductionmentioning
confidence: 99%
“…Micromachining due to the high dimensional accuracy and the possibility of achieving high-aspect-ratio structures has the potential for the manufacturing of mm-wave components. Among different micromachining techniques, silicon-based micromachining [ 5 , 6 ], SU8 photoresist-based process [ 7 , 8 , 9 , 10 , 11 ], and LIGA-based thick layer electroplating [ 12 , 13 ] are suitable for manufacturing mm-wave components.…”
Section: Introductionmentioning
confidence: 99%
“…On the other hand, several different micromachining technologies have been developed over the recent years. Among them, silicon deep dry etching [1,2], LIGA processing [3,4], and thick SU8 photoresist [5,6] are popular. We have recently reported a micromachined coaxial cable operating at 22 GHz with thick SU8 photoresist technology [7].…”
Section: Introductionmentioning
confidence: 99%
“…This is the case of the SU-8 photoresist material process [346], DRIE [365] or LIGA [350], [366], techniques, already commented when hollow waveguides were reviewed for their used at THz frequencies in section 2.3.3.1. Unlike conventional milling techniques, in these photolitographic and chemical techniques, depth and size are preferred to be small.…”
Section: Hollow Metallic Waveguidesmentioning
confidence: 99%
“…Unlike conventional milling techniques, in these photolitographic and chemical techniques, depth and size are preferred to be small. In fact, achieving large dimensions is often a challenge [337]- [338], [346], [350], [365]- [366]. Therefore, whereas these techniques are mandatory at optical and infrared frequencies when dealing with dielectric, Sibased waveguides [465], and preferred at reasonably high THz frequencies for RWG designs [351], it makes little sense in forcing them down in frequency.…”
Section: Hollow Metallic Waveguidesmentioning
confidence: 99%