Novel microstructures and technologies applied in chemical analysis techniques

Spiering, V.L.; Moolen, J.N. van der; Burger, G.J.; Berg, Albert van den

doi:10.1109/sensor.1997.613699

Cited by 20 publications

(13 citation statements)

References 9 publications

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“…In this approach, the relatively low-temperature anodic bonding technique is favourable, especially when metallization is involved. Different types of silicon-based MCE systems have been constructed in this approach [8][9][10]. Typically, an oxide layer is grown on the silicon substrate, prior to the bonding process, in order to insulate the semiconducting substrate from the running electrophoresis buffer.…”

Section: Introductionmentioning

confidence: 99%

Design and fabrication of an integrated microsystem for microcapillary electrophoresis

Chan

Carles

Sucher

et al. 2003

J. Micromech. Microeng.

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A capillary electrophoresis microsystem integrated with feed-through platinum electrodes was designed and fabricated for the separation of DNA fragments. A novel glass-to-silicon bonding technology, which allows anodic bonding of a glass wafer to a silicon wafer coated with a thick dielectric film by the inclusion of a thin intermediate amorphous silicon layer, was developed and employed to construct the microsystem. Despite the existence of a thick insulating material and non-uniform topography, robust devices without fluid leakage were obtained. Electrophoretic manipulation and separation of DNA fragments after capillary pre-treatment have been demonstrated and several operational considerations are discussed. The system performance suggests that silicon-based microsystems can be advantageous and practical for the fabrication of integrated microcapillary electrophoresis devices.

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Section: Introductionmentioning

confidence: 99%

Design and fabrication of an integrated microsystem for microcapillary electrophoresis

Chan

Carles

Sucher

et al. 2003

J. Micromech. Microeng.

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“…Previously, capillary tubes have been connected to microfluidic devices by means of fitting to precision-machined holes [1] or microfabricated openings [3][4][5][6]. Adhesives are generally used after the assembly process of these interconnectors to prevent leakage.…”

Section: Introductionmentioning

confidence: 99%

Micro-to-macro fluidic interconnectors with an integrated polymer sealant

Tsai

Liu

2001

J. Micromech. Microeng.

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This paper presents the design, fabrication and testing results of inserting a polymer sealant (Mylar) into a micro-to-macro fluidic interconnection. Two processes, discrete and integrated Mylar sealant, have been developed by means of post-fabrication after the mircofluidic components such as micro-channels and micro-chambers are constructed. The integrated process utilizes microfabrication techniques such that batch processing is feasible and the sealant dimensions can be precisely controlled. The discrete process takes advantage of easy and simple processing and is compatible with most microfluidic systems without any extra wafer-level micromachining process. In both processes, macroscale capillary tubes with a diameter of 320 µm have been successfully connected to microscale channels with the help of the Mylar. Both leakage and pull-out tests are conducted and successfully demonstrate the functionality of the interconnectors. The leakage test shows that no leakage is observed up to 190 kPa and the pull-out test proves 100% survival rate under a pulling force of 2 N.

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“…All bulk etching processes, such as buffered oxide etching [6], HF etching [7], dry etching [8], deep reactive ion etching [9] and many more can be used showing different advantages (like high aspect ratio) and disadvantages (e.g. isotropic etch distribution).…”

Section: Manufacturing Of Microfluidic Systemsmentioning

confidence: 99%