2009
DOI: 10.1007/s11340-009-9221-1
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Novel Microtensile Method for Monotonic and Cyclic Testing of Freestanding Copper Thin Films

Abstract: This paper presents the results of new microtensile tests conducted to investigate the mechanical properties of submicron-thick freestanding copper films. The method, used in this study, allows the observation of materials response under uniaxial tensile loads with measurements of stress at strain rates up to 5.5 x 10(-4)/s. It also facilitates tension-tension fatigue experiments under a variety of mean stress conditions at cyclic loading frequencies to 20 Hz. The sample processes involve fabrication of a supp… Show more

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Cited by 21 publications
(11 citation statements)
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“…Piezoelectric [339,340] and electrostatic [337] external actuators have been used to pull on the films. These testing platforms can be designed to allow cyclic loadings for fatigue analysis, see for instance [341][342][343]. High resolution CCD camera and optical microscope can be adapted to look at the specimens during deformation and, if needed, apply digital image correlation analysis to extract strain fields afterwards.…”
Section: Fracture Testing Methods Of Freestanding Specimensmentioning
confidence: 99%
“…Piezoelectric [339,340] and electrostatic [337] external actuators have been used to pull on the films. These testing platforms can be designed to allow cyclic loadings for fatigue analysis, see for instance [341][342][343]. High resolution CCD camera and optical microscope can be adapted to look at the specimens during deformation and, if needed, apply digital image correlation analysis to extract strain fields afterwards.…”
Section: Fracture Testing Methods Of Freestanding Specimensmentioning
confidence: 99%
“…Freestanding films with submicrometer thickness have yet hardly been investigated, [12][13][14] largely due to the difficult sample handling. As a consequence, their fatigue behavior remains largely unknown.…”
Section: Introductionmentioning
confidence: 99%
“…Relevant works published in EM within the last decade include reports of new micromechanical testing devices that are capable of nanometer-resolution measurements of the tensile and flexure strength of materials employed in the construction of MEMS [89,90]. Another work employed a novel microtensile testing method to investigate the failure characteristics of copper thin films, a potential construction material for MEMS [91]. In 2005, Ozdoganlar et al evaluated a straightforward method of studying the dynamic behavior of MEMS using a piezoelectric shaker and a laser interferometer [92].…”
Section: Sensors and Microscale Devicesmentioning
confidence: 99%