2019
DOI: 10.1109/access.2019.2892654
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Novel Multi-Material 3-Dimensional Low-Temperature Co-Fired Ceramic Base

Abstract: This paper proposes a novel multi-material 3D low-temperature co-fired ceramic base called NeuroStone. It employs 3D inkjet printing with ceramic and copper particle suspension, followed by cofiring. This technology provides both free-form and non-planar electrodes not only on the surface but also inside the device. NeuroStone makes it possible to enhance the directional freedom and electrode packing density in the field of miniature interconnection devices. This report demonstrates that the proposed technolog… Show more

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Cited by 9 publications
(10 citation statements)
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“…3D printing of highly pure copper with superior electrical and thermal properties has been studied extensively due to its broad potential in many applications including electronic devices [1,[12][13][14][15][16][17][18][19][20], thermal management systems [4,12], and the aerospace industry [4,12,[21][22][23][24][25]. Compared to conventional 3D printing of highly pure copper with superior electrical and thermal properties has been studied extensively due to its broad potential in many applications including electronic devices [1,[12][13][14][15][16][17][18][19][20], thermal management systems [4,12], and the aerospace industry [4,12,[21][22][23][24][25]. Compared to conventional fabrication methods such as metal casting, welding, and machining, 3D printing can fabricate more optimized and complex 3D copper parts without using additional tools [26][27][28][29][30][31]…”
Section: Introductionmentioning
confidence: 99%
“…3D printing of highly pure copper with superior electrical and thermal properties has been studied extensively due to its broad potential in many applications including electronic devices [1,[12][13][14][15][16][17][18][19][20], thermal management systems [4,12], and the aerospace industry [4,12,[21][22][23][24][25]. Compared to conventional 3D printing of highly pure copper with superior electrical and thermal properties has been studied extensively due to its broad potential in many applications including electronic devices [1,[12][13][14][15][16][17][18][19][20], thermal management systems [4,12], and the aerospace industry [4,12,[21][22][23][24][25]. Compared to conventional fabrication methods such as metal casting, welding, and machining, 3D printing can fabricate more optimized and complex 3D copper parts without using additional tools [26][27][28][29][30][31]…”
Section: Introductionmentioning
confidence: 99%
“…3). Murata's NeuroStone ™ technology makes such a design possible by combining a multi-material 3D-printing process with custom inks for ceramic, copper, and support materials [8].…”
Section: B Implant Packagingmentioning
confidence: 99%
“…These layers harden as the solvents evaporate. After the layering of materials is complete, the electrode is placed in a hypoxic environment containing N 2 /H 2 atmosphere and heated to above 800°C [8]. This co-firing process removes the support material, resulting in the presented electrode structure (Fig.…”
Section: Electrode Design and Constructionmentioning
confidence: 99%
See 1 more Smart Citation
“…[ 27 ] Furthermore, both ceramic matrix and silver conductor were built via inkjet printing but a large shrinkage rate was observed due to the low solid content of the inks. [ 22 ] In the view of previous work, DW shows unique advantages for customizing ceramic electronics: 1) a variety of raw materials with different physical and chemical properties can be handled by DW processes; 2) DW modules are versatile and can be easily installed to existing AM equipment; 3) the digital fabrication nature of DW enables great design and manufacturing flexibility which is particularly desirable for circuitry patterning.…”
Section: Introductionmentioning
confidence: 99%