Novel Packaging Structure Using VCSEL Array and Multi-Core Fiber for Co-Packaged Optics

Yagisawa, Takatoshi; Miyoshi, Makoto; Miike, Jumpei; Azuma, Tomio; Harada, Yoshio; Ide, Satoshi; Morito, Ken

doi:10.1109/icsj55786.2022.10034665

2022 IEEE CPMT Symposium Japan (ICSJ) 2022

DOI: 10.1109/icsj55786.2022.10034665

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Novel Packaging Structure Using VCSEL Array and Multi-Core Fiber for Co-Packaged Optics

Takatoshi Yagisawa

Makoto Miyoshi

Jumpei Miike

et al.

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Cited by 10 publications

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High-Speed, Low-Power, and Small-Area Optical Receiver in 65-nm CMOS

Tsuchiya,

Inoue,

Kishine

et al. 2023

2023 IEEE 15th International Conference on ASIC (ASICON)

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Novel Packaging Structure Using VCSEL Array and Multi-Core Fiber for Co-Packaged Optics

Cited by 10 publications

References 5 publications

High-Speed, Low-Power, and Small-Area Optical Receiver in 65-nm CMOS

High-Speed, Low-Power, and Small-Area Optical Receiver in 65-nm CMOS

A 4×32-Gb/s VCSEL Driver with Adaptive Feedforward Equalization in 65-nm CMOS

Testing station using a 0.3-mm-pitch LGA interface for a 25-Gbaud x 16-channel CPO transceiver

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