2024
DOI: 10.1002/app.55889
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Novel phase‐change PDA‐Ni@GNS/CNF‐C/SA/PEG composites with ultrahigh shape stability and latent heat as thermal management material for microelectronic devices

Xiaohong Wang,
Bin Yang,
Yue Zhang
et al.

Abstract: Phase‐change materials (PCMs) have become a hot spot in the development of modern thermal management materials because of their absorbing and releasing heat while keeping the temperature constant during phase change process. However, their relatively low thermal conductivity (TC) considerably restricts their further application. In this work, graphene nanosheets (GNS) were initially nickel‐plated to increase the contact area between adjacent GNS (in the form of Ni@GNS) by constructing a “point‐surface” structu… Show more

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