“…For all these reasons there is a strong effort in fabrication procedures both in academic and in industrial laboratories. Porous metal and semiconductors are generally fabricated by electrochemical methods, like dealloying (Cu, Pt, Pd, Au, and Ag) [1][2][3] and selective etching (Si, SiC, TiO 2 , InP, GaP, GaAs) [4,5], but also exploiting the possibilities of classic micromachining techniques, such as chemical vapors deposition or plasma enhanced chemical vapors deposition, and electro-spinning [6]. Depending on the parameters of he fabrication processes, but also on the characteristics of the bulk materials (doping level, orientation, purity, and so on), a very broad range of porosity and pore size dimensions can be achieved: again, in the case of the porous silicon, porosities between 30% and 90%, and pores size ranging in the nanometer to micrometer interval, can be easily obtained.…”