Microencapsulated phase change materials
(PCMs) are attracting
increasing attention as functional fillers in polymer matrices, to
produce smart thermoregulating composites for applications in thermal
energy storage (TES) and thermal management. In a polymer composite,
the filler–matrix interfacial adhesion plays a fundamental
role in the thermomechanical properties. Hence, this work aims to
modify the surface of commercial PCM microcapsules through the formation
of a layer of polydopamine (PDA), a bioinspired polymer that is emerging
as a powerful tool to functionalize chemically inert surfaces due
to its versatility and great adhesive potential in many different
materials. Scanning electron microscopy (SEM) and atomic force microscopy
(AFM) evidenced that after PDA coating, the surface roughness increased
from 9 to 86 nm, which is beneficial, as it allows a further increase
in the interfacial interaction by mechanical interlocking. Spectroscopic
techniques allowed investigating the surface chemistry and identifying
reactive functional groups of the PDA layer and highlighted that,
unlike the uncoated microcapsules, the PDA layer is able to react
with oxirane groups, thereby forming a covalent bond with the epoxy
matrix. Hot-stage optical microscopy and differential scanning calorimetry
(DSC) highlighted that the PDA modification does not hinder the melting/crystallization
process of the paraffinic core. Finally, SEM micrographs of the cryofracture
surface of epoxy composites containing neat or PDA-modified microcapsules
clearly evidenced improved adhesion between the capsule shell and
the epoxy matrix. These results showed that PDA is a suitable coating
material with considerable potential for increasing the interfacial
adhesion between an epoxy matrix and polymer microcapsules with low
surface reactivity. This is remarkably important not only for this
specific application but also for other classes of composite materials.
Future studies will investigate how the deposition parameters affect
the morphology, roughness, and thickness of the PDA layer and how
the layer properties influence the capsule–matrix adhesion.