2022
DOI: 10.1007/s11432-021-3324-0
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Novel SiC SBD-wall-integrated trench MOSFET with a semi-superjunction and split trench gate

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Cited by 4 publications
(1 citation statement)
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“…In order to reduce the power dissipation in high frequency and high power applications, the Cgd of the MOSFET must be minimized because the power dissipation originates from their charging and discharging during each switching cycle [19][20][21]. Based on this, Split Gate Trench (SGT) MOSFETs are becoming key components for various high efficiency medium to high voltage power applications due to their relatively low switching losses [22][23][24]. The SG structure serves as a vertical field plate which optimizes the electric field distribution of the drift region under the instruction of RESURF theory [25].…”
Section: Introductionmentioning
confidence: 99%
“…In order to reduce the power dissipation in high frequency and high power applications, the Cgd of the MOSFET must be minimized because the power dissipation originates from their charging and discharging during each switching cycle [19][20][21]. Based on this, Split Gate Trench (SGT) MOSFETs are becoming key components for various high efficiency medium to high voltage power applications due to their relatively low switching losses [22][23][24]. The SG structure serves as a vertical field plate which optimizes the electric field distribution of the drift region under the instruction of RESURF theory [25].…”
Section: Introductionmentioning
confidence: 99%