Novel solder ally with wide service temperature capability for automotive applications

Geng, Jie; Zhang, Hongwen; Mutuku, Francis; Lee, Ning-Cheng

doi:10.1109/icept.2017.8046762

2017 18th International Conference on Electronic Packaging Technology (ICEPT) 2017

DOI: 10.1109/icept.2017.8046762

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Novel solder ally with wide service temperature capability for automotive applications

Jie Geng

Hongwen Zhang

Francis Mutuku

et al.

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Novel solder ally with wide service temperature capability for automotive applications

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References 5 publications

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