“…Commercial standalone laser systems implementing ultra-short-pulsed lasers specifically for sample preparation are effective for large-area preparation and package dissection but lack optimization for the fastest targeted microscopy preparation where ablation speed and sample quality are simultaneously important, since vacuum environments produce the best laser ablation and sample quality, in turn enabling efficiency for the subsequent FIB polishing steps. In contrast, the integrated LaserFIB approach has proven efficient and effective in correlative workflows with optical or XRM microscopy for a variety of research and industrial applications, including characterization of microbumps in a 3D package (14), development of automotive bumpers from recycled materials (15), correlative microscopy for rapid screening of Zr-containing particles for geochronology (16), and identification of random particles within an OLED display (17). Figure 8.…”
Section: Advances In Focused Ion Beam Scanning Electron Microscopesmentioning
The line between packaging and silicon interconnect technology is blurring due to a reduction in package interconnect dimensions, which drives an increase in image resolution requirements. It is becoming more difficult to localize and image defects and structures throughout the packaging life cycle, from materials selection, through package and silicon design co-optimization, development, production, and field failure diagnostics. Characterization and failure analysis (FA) solutions must provide fast results for rapid development of packages meeting the required electrical, mechanical and reliability specifications with high yield and quality. Heterogeneous integration and complex packages containing multiple die drive new approaches to rapidly characterize structures, defects and processes. This paper presents new artificial intelligence (AI) developments in 3D X-ray microscopy (XRM) for non-destructive submicron-resolution imaging of packages. It also introduces the latest developments in focused ion beam (FIB) microscopes adapted with an integrated fs-laser for precise and fast analysis of deeply buried features in advanced packages.
“…Commercial standalone laser systems implementing ultra-short-pulsed lasers specifically for sample preparation are effective for large-area preparation and package dissection but lack optimization for the fastest targeted microscopy preparation where ablation speed and sample quality are simultaneously important, since vacuum environments produce the best laser ablation and sample quality, in turn enabling efficiency for the subsequent FIB polishing steps. In contrast, the integrated LaserFIB approach has proven efficient and effective in correlative workflows with optical or XRM microscopy for a variety of research and industrial applications, including characterization of microbumps in a 3D package (14), development of automotive bumpers from recycled materials (15), correlative microscopy for rapid screening of Zr-containing particles for geochronology (16), and identification of random particles within an OLED display (17). Figure 8.…”
Section: Advances In Focused Ion Beam Scanning Electron Microscopesmentioning
The line between packaging and silicon interconnect technology is blurring due to a reduction in package interconnect dimensions, which drives an increase in image resolution requirements. It is becoming more difficult to localize and image defects and structures throughout the packaging life cycle, from materials selection, through package and silicon design co-optimization, development, production, and field failure diagnostics. Characterization and failure analysis (FA) solutions must provide fast results for rapid development of packages meeting the required electrical, mechanical and reliability specifications with high yield and quality. Heterogeneous integration and complex packages containing multiple die drive new approaches to rapidly characterize structures, defects and processes. This paper presents new artificial intelligence (AI) developments in 3D X-ray microscopy (XRM) for non-destructive submicron-resolution imaging of packages. It also introduces the latest developments in focused ion beam (FIB) microscopes adapted with an integrated fs-laser for precise and fast analysis of deeply buried features in advanced packages.
“…The integration of a fs-laser with FIB-SEM enables rapid set-up of the optimized recipes that balances speed with high surface quality and minimal redeposition in a series of “test and view” learning cycles. Paired with high-resolution 3D X-ray data for localization, one can cross section a specific targeted 5 μm void in a 3D package (Kaestner et al 2019 ). Fig.…”
The development of the femtosecond laser (fs laser) with its ability to provide extremely rapid athermal ablation of materials has initiated a renaissance in materials science. Sample milling rates for the fs laser are orders of magnitude greater than that of traditional focused ion beam (FIB) sources currently used. In combination with minimal surface post-processing requirements, this technology is proving to be a game changer for materials research. The development of a femtosecond laser attached to a focused ion beam scanning electron microscope (LaserFIB) enables numerous new capabilities, including access to deeply buried structures as well as the production of extremely large trenches, cross sections, pillars and TEM H-bars, all while preserving microstructure and avoiding or reducing FIB polishing. Several high impact applications are now possible due to this technology in the fields of crystallography, electronics, mechanical engineering, battery research and materials sample preparation. This review article summarizes the current opportunities for this new technology focusing on the materials science megatrends of engineering materials, energy materials and electronics.
“…14,15 The use of fs lasers for targeted sample preparation in materials science is a well-established method and has been applied in a variety of different studies. 1,16 Utilization of the fs laser for sample processing in life sciences provides a tool for targeted trimming of soft biological tissue that can complement other available mechanical tools in workflows that are highly dependent on precise specimen trimming, such as ultramicrotomy 17 or lathe implementations. 6 To interrogate the ultrastructure at nanometer scale, tissue specimens of dimensions reaching several cubic millimeters need to be contrasted with heavy metals and embedded in resin.…”
mentioning
confidence: 99%
“…To maximize the usable volume, we aimed to create pillars in close spatial proximity. Pilot experiments suggested that pillar walls could be milled as vertical as 6.0 6 0.8 (n ¼ 3 specimens, n 0 ¼ [13,18,16] 3(e)] but also the round pillar profile was consistently smooth [Fig. 3(f)], important for many x-ray applications.…”
Correlative multimodal imaging is a useful approach to investigate complex structural relations in life sciences across multiple scales. For these experiments, sample preparation workflows that are compatible with multiple imaging techniques must be established. In one such implementation, a fluorescently labeled region of interest in a biological soft tissue sample can be imaged with light microscopy before staining the specimen with heavy metals, enabling follow-up higher resolution structural imaging at the targeted location, bringing context where it is required. Alternatively, or in addition to fluorescence imaging, other microscopy methods, such as synchrotron x-ray computed tomography with propagation-based phase contrast or serial blockface scanning electron microscopy, might also be applied. When combining imaging techniques across scales, it is common that a volumetric region of interest (ROI) needs to be carved from the total sample volume before high resolution imaging with a subsequent technique can be performed. In these situations, the overall success of the correlative workflow depends on the precise targeting of the ROI and the trimming of the sample down to a suitable dimension and geometry for downstream imaging. Here, we showcase the utility of a femtosecond laser (fs laser) device to prepare microscopic samples (1) of an optimized geometry for synchrotron x-ray tomography as well as (2) for volume electron microscopy applications and compatible with correlative multimodal imaging workflows that link both imaging modalities.
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