2020
DOI: 10.1016/j.ceramint.2020.02.118
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Nucleation and growth behavior of aluminum nitride film using thermal atomic layer deposition

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Cited by 20 publications
(11 citation statements)
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“…The variation of growth rate in different solid-solution films may be ascribed to different nucleation sites on different substrates. [42] Therefore, the significantly decreased growth rates of ZnO in G10Z5 and G7Z5 are attributed to the nucleation delay of ZnO on amorphous GaN. On the other hand, the increased growth rates of GaN in G5Z7 or G5Z10 imply that GaN can nucleate more easily on ZnO with a crystalline wurtzite structure.…”
Section: Atomic Stacking In the Solid Solutionsmentioning
confidence: 98%
“…The variation of growth rate in different solid-solution films may be ascribed to different nucleation sites on different substrates. [42] Therefore, the significantly decreased growth rates of ZnO in G10Z5 and G7Z5 are attributed to the nucleation delay of ZnO on amorphous GaN. On the other hand, the increased growth rates of GaN in G5Z7 or G5Z10 imply that GaN can nucleate more easily on ZnO with a crystalline wurtzite structure.…”
Section: Atomic Stacking In the Solid Solutionsmentioning
confidence: 98%
“…[53] When there are no or fewer reaction sites between the buffer layer and the substrate, the ALD process becomes island-like growth (Volmer-Weber), which will inhibit nucleation and delay film growth, resulting in a pinhole layer. [54] Duan's research group reported a ZnO/Mg:Ag-alloy/ ZnO top transparent DMD composite electrode equipped on transparent OLEDs, and by using ALD technology to deposit ZnO on ultra-thin Mg:Ag-alloy, the ZnO layer plays the role of antireflection and encapsulation layer, and the final AVT of the electrode is as high as 84.6%. [53] Recently, the research group applied ALD technology to ST-PSCs, deposited ZnO on Ag through ALD, and designed the ZnO/Ag/ZnO composite electrode structure.…”
Section: Transparent Conductive Oxide (Tco) Electrodesmentioning
confidence: 99%
“…As native substrates of III-nitrides are hardly available (due to the difficulties with incorporating nitrogen), they are commonly grown on mismatched substrates involving thick buffer layers and high temperatures well above the back-end-of-line (BEOL) limit. , Atomic layer deposition (ALD) is a suitable candidate to investigate thin-film deposition of III-nitrides with a reduced thermal budget. In ALD, high conformality and large area uniformity with thickness control at a sub-monolayer scale are enabled by using sequential self-limiting vapor-solid reactions. , It has found use in numerous fabrication processes of devices and circuits with <10 nm feature sizes. ,, Many authors have reported on ALD of Groups III–V (III–V) compounds since Nishizawa et al’s first paper on GaAs in 1985 (). ,, ALD of AlN commenced in the early 1990s with trimethylaluminum (TMA) as the metal precursor and ammonia (NH 3 ) as the nitrogen precursor. Currently, a myriad of precursors, precursor combinations, and reactivity-enhancing techniques have been used to alter the ALD temperature window, limit the incorporation of impurities, and improve stoichiometry and crystallinity. Some authors using TMA as metal precursors have resorted to plasma-enhanced deposition to increase the reactivity of NH 3 at reduced temperatures. ,,,, , One author has employed ultraviolet (UV) radiation during TMA injection...…”
Section: Introductionmentioning
confidence: 99%