Numerical analysis for migration of austenite/ferrite interface during carburization of Fe

Kajihara, Masahiro

doi:10.1007/s10853-009-3299-9

Cited by 28 publications

(31 citation statements)

References 59 publications

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“…For reactive diffusion in binary alloy systems, the growth rate of an intermediate phase is predominantly determined by the interdiffusion coef cient of the growing phase. [12][13][14][15][16][17][18][19][20][21][22] If the interdiffusion coef cient of an intermediate phase is small at an experimental annealing temperature, the intermediate phase cannot grow to visible thicknesses within realistic annealing times. [12][13][14][15][16][17][18][19][20][21][22] Consequently, the interdiffusion coef cient of the β phase must be much smaller than those of the γ and ε phases.…”

Section: Microstructurementioning

confidence: 99%

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Kinetics of Solid-State Reactive Diffusion in the Cu/Zn System

2017

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The kinetics of the solid-state reactive diffusion between pure Cu and Zn was experimentally examined using sandwich Zn/Cu/Zn diffusion couples prepared by a diffusion bonding technique. The diffusion couples were isothermally annealed in the temperature range of 523-623 K for various times up to 49 h. Owing to annealing, an intermetallic layer consisting of the γ and ε phases was formed at the original interface in the diffusion couple, where the thickness is much smaller for the ε phase than for the γ phase. The total thickness of the intermetallic layer increases in proportion to a power function of the annealing time. The exponent of the power function takes values of 0.60-0.62 at 523-623 K. These values of the exponent indicate that volume diffusion predominantly controls the layer growth and interface reaction partially contributes to the rate-controlling process.

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Section: Microstructurementioning

confidence: 99%

“…If the growth of the intermetallic layer is controlled by volume diffusion, n is equal to 0.5. [12][13][14][15][16][17][18][19][20][21][22] On the other hand, n is equivalent to unity, if interface reaction governs the layer growth. [23][24][25][26][27][28] According to the result in Fig.…”

Section: Rate-controlling Process Of Intermetallic Growthmentioning

confidence: 99%

Kinetics of Solid-State Reactive Diffusion in the Cu/Zn System

2017

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“…75) Although the growth rate is not necessarily a simple mathematical function of the interdiffusion coefficient, it is surely a monotonically increasing function of the interdiffusion coefficient. [75][76][77][78][79][80][81][82][83][84] In the early stages, many fine Fe 2 Al 5 grains with random crystallographic orientations are produced at the Fe/Al interface. 72) Of these random grains, those with the c axis nearly perpendicular to the Fe/Al interface preferentially grow along the c axis over long distances without impingement.…”

Section: Microstructurementioning

confidence: 99%

“…In such a case, the growth of the intermetallic layer is not described by any simple mathematical models reported in previous studies. [75][76][77][78][79][80][81][82][83][84] As a consequence, the rate-controlling process for the growth of the intermetallic layer cannot be estimated from the value of Q k in a straightforward manner.…”

Section: Growth Behavior Of Intermetallic Layermentioning

confidence: 99%

Morphology of Compounds Formed by Isothermal Reactive Diffusion between Solid Fe and Liquid Al

Tanaka

Kajihara

2009

Mater. Trans.

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“…Such transition of the rate-controlling process in the reactive diffusion is realized also for other alloy systems. 16,22,23) For instance, the reactive diffusion between Ta and a bronze was experimentally observed in a previous study. 16) In this experiment, diffusion couples composed of Ta and a Cu-9.3 at% Sn-0.3 at% Ti alloy were isothermally annealed at T ¼ 973{1053 K for various times up to t ¼ 1462 h (5:26 Â 10 6 s).…”

Section: Transition Of Rate-controlling Processmentioning

confidence: 86%

Kinetics of Solid-State Reactive Diffusion between Au and Al

Minho

Kajihara

2011

Mater. Trans.

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In the wire bonding technique, a thin Au wire is interconnected with an Al layer on a Si chip. During energization heating at solid-state temperatures, however, brittle Au-Al compounds with high electrical resistivities are formed at the interconnection by the reactive diffusion between Au and Al. In order to examine the growth behavior of the Au-Al compounds, the kinetics of the reactive diffusion was experimentally observed using sandwich Al/Au/Al diffusion couples. The diffusion couple was prepared by a diffusion bonding technique and then isothermally annealed at temperatures of 623-723 K for various times up to 103 h. Under such annealing conditions, the diffusion couple is practically considered semi-infinite. Owing to annealing, compound layers consisting of AuAl 2 , AuAl and Au 8 Al 3 are produced at the initial Au/Al interface in the diffusion couple. The volume fraction in the compound layers is larger for Au 8 Al 3 than for AuAl and AuAl 2 in the early stages but becomes smaller for Au 8 Al 3 than for AuAl and AuAl 2 in the late stages. However, there are no systematic dependencies of the volume fraction on the annealing time and temperature. The total thickness of the compound layers is proportional to a power function of the annealing time. The exponent of the power function is smaller than 0.5 at 673-723 K. The exponent smaller than 0.5 means that the interdiffusion across the compound layers governs the layer growth and boundary diffusion predominantly contributes to the interdiffusion. On the other hand, at 623 K, the exponent is equal to unity for annealing times shorter than 8 h but smaller than 0.5 for those longer than 8 h. The exponent of unity indicates that the layer growth is controlled by the interface reaction at the migrating interface. Thus, at T ¼ 623 K, the transition of the ratecontrolling process occurs at a critical annealing time of 8 h.

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Numerical analysis for migration of austenite/ferrite interface during carburization of Fe

Cited by 28 publications

References 59 publications

Kinetics of Solid-State Reactive Diffusion in the Cu/Zn System

Kinetics of Solid-State Reactive Diffusion in the Cu/Zn System

Morphology of Compounds Formed by Isothermal Reactive Diffusion between Solid Fe and Liquid Al

Kinetics of Solid-State Reactive Diffusion between Au and Al

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