Numerical analysis method of heat transfer in an electronic component using sensitivity analysis

Souhar, Otmane; Prud'Homme, Christophe

doi:10.1007/s10825-014-0630-8

Cited by 3 publications

(2 citation statements)

References 21 publications

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“…However, the decomposition of the matrices into offline/online pieces requires modifying the calculation code, leading to an intrusive procedure. Examples of the standard reduced basis method applied to heat transfer problems can be found in [8,21,24,25]. In some situation -with a commercial CFD code for example -it is not possible to perform all the offline computations required to have a inexpensive and fast online stage.…”

Section: Introductionmentioning

confidence: 99%

A non-intrusive reduced basis approach for parametrized heat transfer problems

Chakir¹,

Maday

Parnaudeau

2019

Journal of Computational Physics

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Computation Fluid Dynamics (CFD) simulation has become a routine design tool for i) predicting accurately the thermal performances of electronics set ups and devices such as cooling system and ii) optimizing configurations. Although CFD simulations using discretization methods such as finite volume or finite element can be performed at different scales, from component/board levels to larger system, these classical discretization techniques can prove to be too costly and time consuming, especially in the case of optimization purposes where similar systems, with different design parameters have to be solved sequentially. The design parameters can be of geometric nature or related to the boundary conditions. This motivates our interest on model reduction and particularly on reduced basis methods. As is well documented in the literature, the offline/online implementation of the standard RB method (a Galerkin approach within the reduced basis space) requires to modify the original CFD calculation code, which for a commercial one may be problematic even impossible. For this reason, we have proposed in a previous paper, with an application to a simple scalar convection diffusion problem, an alternative non-intrusive reduced basis approach (NIRB) based on a two-grid finite element discretization. Here also the process is two stages: offline, the construction of the reduced basis is performed on a fine mesh; online a new configuration is simulated using a coarse mesh. While such a coarse solution, can be computed quickly enough to be used in a rapid decision process, it is generally not accurate enough for practical use. In order to retrieve accuracy, we first project every such coarse solution into the reduced space, and then further improve them via a rectification technique. The purpose of this paper is to generalize the approach to a CFD configuration.

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Section: Introductionmentioning

confidence: 99%

A non-intrusive reduced basis approach for parametrized heat transfer problems

Chakir¹,

Maday

Parnaudeau

2019

Journal of Computational Physics

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“…This criterion has to be respected under the most unfavorable thermal and geometric conditions. The thermal design and management of the electronic assemblies are highly dependent on several physical parameters and the environment in which they are installed [20][21]. The effects of the molding compound on the QFN64's maximal temperature has been quantified in the survey [22] which shows that the material used to encapsulate the package significantly affects its thermal behaviour during operation.…”

Section: Introductionmentioning

confidence: 99%

Thermal state of electronic assemblies applied to smart building equipped with QFN64 device subjected to natural convection

Baı̈ri

Roseiro

Martín-Garín

et al. 2017

Microelectronics Reliability

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The performance and reliability of electronic components and assemblies strongly depend on their thermal state. The knowledge of the temperature distribution throughout the assembly is therefore an essential element to ensure their correct operation. This is the main objective of this work that examines the case of a conventional assembly equipped with a quad flat non-lead QFN64 subjected to free convection. This active electronic package is welded on a PCB which may be inclined by an angle varying between 0°and 90°(horizontal and vertical positions respectively) and generates during its operation a high power ranging from 0.1 to 1 W. Thermoregulation of the assembly is ensured by natural convection, given its many well known advantages in this engineering field. Accurate relationships are proposed to determine the temperature on different areas of the device and the PCB. They are determined by means of a 3D numerical approach based on the finite volume method confirmed by measurements on an actual installation. These relationships allow reliability improvement of these electronic assemblies that are widely used in many engineering fields such as computing industry, mobile telephony, home automation, automotive, embarked electronics and the smart building applications considered in this work. The present survey complements a recent study which quantifies the natural convective heat transfer on the considered electronic assembly equipped with the QFN64 device, for the same power range and angle of inclination.

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