2019
DOI: 10.1002/slct.201903204
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Numerical and Experimental Analysis of Copper Electroforming on an Aluminum Substrate as a Rotating Cone Electrode Cell

Abstract: In this paper, the advantages of numerical simulation to improve the process of copper electroforming are demonstrated. In this regard, the finite element model of copper electroforming for a rotating cone electrode was first prepared and then, the effect of the key parameters, such as applied current density, solution conductivity, electrode spacing, and anode height, on the uniformity of the thickness was investigated. The model combines tertiary current distribution with Bulter–Volmer electrode kinetics and… Show more

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