Numerical and Experimental Investigations of the Thermal Fatigue Lifetime of CBGA Packages

Abstract

A thermal fatigue lifetime prediction model of ceramic ball grid array (CBGA) packages is proposed based on the Darveaux model. A finite element model of the CBGA packages is established, and the Anand model is used to describe the viscoplasticity of the CBGA solder. The average viscoplastic strain energy density increment Wave of the CBGA packages is obtained using a finite element simulation, and the influence of different structural parameters on the Wave is analyzed. A simplified analytical model of the Wave is established using the simulation data. The thermal fatigue lifetime of CBGA packages is obtained from a thermal cycling test. The Darveaux lifetime prediction model is modified based on the thermal fatigue lifetime obtained from the experiment and the corresponding Wave. A validation test is conducted to verify the accuracy of the thermal fatigue lifetime prediction model of the CBGA packages. This proposed model can be used in engineering to evaluate the lifetime of CBGA packages.

Numerical Simulation of Low Cycle Fatigue Behavior of Ti2AlNb Alloy Subcomponents

“…Continuum Damage Mechanics (CDM) has been rapidly developed and applied in recent years. CDM theory connects fatigue with microcrack evolution and further develops the traditional fatigue theory [28][29][30][31]. Compared with the classical fatigue theory, CDM theory is more consistent with the microscopic mechanism of the fatigue process observed in the experiments.…”