Numerical and experimental study of the effect of thermocouple wire attachment on thermal characterization of a high performance flipchip package

Gondipalli, Sravan; Bhopte, Siddharth; Sammakia, Bahgat; Calmidi, Varaprasad

doi:10.1109/itherm.2010.5501260

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2011

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“…Alternatively, one can solder or glue a thermocouple onto the case surface (lid or bare die) [6]. Good contact is guaranteed by solder or high conductive epoxy.…”

Section: Introductionmentioning

confidence: 99%

Accurate Theta jc measurement for high power packages

Wan

Galloway

2011

2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium

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Measuring the case temperature is one of the most challenging measurements for determining the junction-tocase thermal resistance (Theta jc) in high power packages. This is especially true for low Theta jc measurement, in which high power is necessary to control accuracy. Inaccurate case temperature measurement would lead to an inaccurate Theta jc value. This study explores different methods for measuring case temperature and quantifies their impact on Theta jc. A new method of cold-plate protruded thermocouple is proposed and compared with commonly adopted method of lid embedded thermistor both experimentally and numerically. It is found correction is not negligible for low Theta jc measurement in both methods due to the temperature difference between the case surface and the thermal probe location. A standard test jig is also proposed to determine the correction for the cold-plate protruded thermocouple experimentally.

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“…Alternatively, one can solder or glue a thermocouple onto the case surface (lid or bare die) [6]. Good contact is guaranteed by solder or high conductive epoxy.…”

Section: Introductionmentioning

confidence: 99%

Accurate Theta jc measurement for high power packages

Wan

Galloway

2011

2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium

View full text Add to dashboard Cite

show abstract

Numerical and experimental study of the effect of thermocouple wire attachment on thermal characterization of a high performance flipchip package

Cited by 1 publication

References 8 publications

Accurate Theta jc measurement for high power packages

Accurate Theta jc measurement for high power packages

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