Numerical Calculations of Mass Transfer Through Laminar Boundary Layer With Moving Interface

Ueyama, Korekazu; Hatanaka, Jun-Ichi; Ogawa, Kazushige

doi:10.1252/jcej.5.371

J. Chem. Eng. Japan

1972

DOI: 10.1252/jcej.5.371

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Numerical Calculations of Mass Transfer Through Laminar Boundary Layer With Moving Interface

Korekazu Ueyama

Jun-Ichi Hatanaka

Kazushige Ogawa

Abstract: A similarity analysis is applied to steady cocurrent flows with a mobile interface, and a method is suggested to calculate the velocity profiles in both phases. With this method the velocity profiles and mass transfer coefficients are numerically obtained for a simple flow system. It is shown that, approximately, SfioC]//^^-9 and that the dimensionless velocity gradient at the interface can be reasonably neglected for mass transfer calculations.

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“…Friedlander and Lift (35) and Acrivos (36) used the reaction plane concept in their analyses of laminar boundary layer flows with a homogeneous reaction. Others (37)(38)(39)(40)(41)(42)(43)(44)(45)(46)(47)(48)(49)(50)(51) have also studied this subject.…”

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Potential‐Selective Deposition of Copper from Chloride Solutions Containing Iron

White

Trainham

Newman

et al. 1977

J. Electrochem. Soc.

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The hydrometallurgy of copper may involve leaching of the metal from its ore with an aqueous solution containing cupric and ferric chloride. The subsequent deposition of copper from such a process stream is modeled here in an idealized electrochemical cell with a rotating‐disk electrode. The potential distribution and concentration profiles within the diffusion layer are predicted for given potential differences between the electrode and the solution. The cuprous ion, which is formed by the reduction of the complexed cupric ion at the electrode, is stabilized in the chloride solution and can react either at the electrode or with ferric species within the diffusion layer. The assumption is that this fast and irreversible homogeneous reaction generates a reaction plane, whose position is shown in the concentration and potential profiles. In addition, the position of the reaction plane is plotted as a function of the potential difference between the electrode and the adjacent solution. Predicted current‐potential and current efficiency‐potential curves are also reported. Finally, the iron contamination of the deposited copper is estimated to be less than 10−5atom percent for some cases. Also, because some of the partial current densities are below their limiting values, the analysis is strictly valid only at the center of the disk.

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mentioning

confidence: 99%

Potential‐Selective Deposition of Copper from Chloride Solutions Containing Iron

White

Trainham

Newman

et al. 1977

J. Electrochem. Soc.

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Effect of interfacial velocity and interfacial tension gradient on momentum, heat and mass transfer

1989

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The effect of interfacial velocity and interfacial tension gradient on momentum, heat and mass transfer was studied theoretically. After reviewing current knowledge regarding interfacial velocity effects, the interfacial tension gradient effect is discussed as a numerical solution of the laminar boundary layer equations. The enhancement and suppression of interfacial mobility, and the rates of interphase momentum, heat and mass transfer were related to the Marangoni number. A diagram showing the effect of interfacial tension gradient on momentum, heat and mass transfer is presented.

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Numerical Calculations of Mass Transfer Through Laminar Boundary Layer With Moving Interface

Cited by 2 publications

References 0 publications

Potential‐Selective Deposition of Copper from Chloride Solutions Containing Iron

Potential‐Selective Deposition of Copper from Chloride Solutions Containing Iron

Effect of interfacial velocity and interfacial tension gradient on momentum, heat and mass transfer

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