2021
DOI: 10.1002/er.6404
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Numerical investigation of cross plate fin heat sink integrated with phase change material for cooling application of portable electronic devices

Abstract: The design of thermal management system needs to be made in such a way that can avoid the possible overheating and failure of electronic components because of higher power density. Thermal performance of heat sink (HS) configurations involving different number of cavities (1, 4, 9, 16, 25, and 36), formed by cross plate fins arrangement, as applicable to thermal management of electronic components, are studied numerically by employing pressure-based finite volume method. Mass and thermal capacity of each HS co… Show more

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Cited by 26 publications
(7 citation statements)
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“…PPI is one of the crucial parameters which affects the PCM-foam sink directly. For a given porosity, the lower values of PPI lead to foam with bigger pores, the reverse relationship between the size of the mean pores of foam and the PPI has been described earlier in Equation (11). The bigger pores, the higher the natural convective heat rate.…”
Section: Resultsmentioning
confidence: 82%
See 1 more Smart Citation
“…PPI is one of the crucial parameters which affects the PCM-foam sink directly. For a given porosity, the lower values of PPI lead to foam with bigger pores, the reverse relationship between the size of the mean pores of foam and the PPI has been described earlier in Equation (11). The bigger pores, the higher the natural convective heat rate.…”
Section: Resultsmentioning
confidence: 82%
“…9 Such a disadvantage increases PCM's melting time and creates a hightemperature zone near the heat source with nonuniform temperature distribution. To improve the thermal performance of PCM, a composite of PCM with nanoparticles, 10 fins, 11 or foam 12 has been proposed by researchers.…”
mentioning
confidence: 99%
“…Thermal energy management is a topic with applications in several industrial fields, such as temperature regulation in green buildings, [1][2][3][4][5][6][7] prevention of overheating in electronic devices, [8][9][10][11][12] and heat and energy harvesting. [13][14][15][16][17] Various methods have been researched and employed with the goal of attaining high efficiency and a low carbon footprint in alignment with the goal of sustainability.…”
Section: Introductionmentioning
confidence: 99%
“…Accordingly, various techniques have been modelled to improve the heat transfer efficiency of the PCM during the charging and discharging methods [18]. These techniques include a combination with the high conductive materials (nanoparticles) [19][20][21][22][23], utilizing an extended surface area for the heat transfer (fins) [21,[24][25][26], combinations with the metal foam [27][28][29][30][31], and using more efficient geometries designs [28,32,33]. Moreover, natural convection is a critical mechanism that can assist the phase change heat transfer in molten regions.…”
Section: Introductionmentioning
confidence: 99%
“…Using smaller values for the gap width between the tubes currying the heat-transfer fluid (HTF) increases the heat-exchanging areas between the PCM and HTF in charge. Therefore, the frustum tube configurations with smaller gap widths have a better potential for enhancing the PCM thermal response during the melting process (3) In comparison to the straight tube configuration, the total melting times could be saved by25.6, 14.2, 11.8, 23.1, 17.5, 19.0, 23.0, and 14.9% for the studied cases from 1 to 8, respectively. The results also indicate that the heat storage rate for the same studied cases could be raised by 32.8%, 16.1%, 13.1%, 29.0%, 21.0, 21.7, 29.1%, and 17.3%, respectively…”
mentioning
confidence: 99%