Abstract-The models of the porous-microchannel heat sinks (porous-MCHSs) with different porous configurations are established in this work. Thermal performances of the porousMCHSs are investigated with the Reynolds number ranging from 45 to 1350. The results indicate that, compared with the results of non-porous MCHS, the thermal performances can be enhanced by using the porous configurations and increase with an increase in the Reynolds number, except for the case with a lower Reynolds number. Both the sandwich and the trapezoidal distribution designs have the best heat transfer efficacy, cooling performance and convective performance. In particular, the thermal performance for rectangular, outlet enlargement, thin rectangular, or block distribution design is not necessarily better than that without porous medium under lower pumping power. Finally, the sandwich distribution design is the best design of the porous-MCHSs by considering the thermal performance along with the pressure drop.
Index Terms-Porous-microchannel, heat sink (porous-MCHS).
I. INTRODUCTIONThe 3-D numerical model to investigate the effects of the porous configuration designs on the thermal performance of the porous-microchannel heat sinks (porous-MCHSs, as shown in Fig. 1) were proposed in this paper. The porousmicrochannel heat sinks make use of the insertion of a porous metallic medium into the microchannel to raise both the surface contact area-to-volume ratio with the coolant and the local velocity mixing of the coolant. Higher contact surface area-to-volume ratio and velocity mixing of the fluid provide a better convective heat transfer effect [1], [2]. It is known [3]-[10] that the heat transfer performance of porousMCHSs can be improved if the configurations of porosity are properly designed. The heat transfer improvement makes the porous-MCHSs possible of implementing a task of micro-scale electronics cooling [1], [2], [10].Many efforts have been devoted to improve the cooling performance of porous channels [1]- [10]. A sintered porous heat sink for the cooling of high-powered compact microprocessors was examined experimentally by Singh et al. [1]. The forced convection in porous rectangular ducts was performed by Calmidi and Mahajan [3] and Haji-Sheikh Manuscript received April 14, 2015; revised July 20, 2015. This work was supported in part by the National Science Council, R. O. C.Tu-Chieh Hung is with the Department of Mechanical Engineering, R.O.C Military Academy, Kaohsiung 83059, Taiwan (e-mail: christ.rich@msa.hinet.net).Yu-Xian Huang is with Delta Electronics, Tainan County 74144, Taiwan (e-mail: frank-303@yahoo.com.tw).Wei-Mon Yan is with the Department of Energy and Refrigerating AirConditioning Engineering, National Taipei Universi, Taiwan. et al. [4]. Zehforoosh and Hossainpour [5] investigated numerically the laminar forced convection in a partially porous channel using four dissimilar porous blocks attached to strip heat sources at the bottom wall. The fluid flow and heat transfer characteristics of a porous heat sink...