2024
DOI: 10.1108/ssmt-08-2023-0049
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Numerical investigation of thermal fatigue crack growth behavior in SAC305 BGA solder joints

Rilwan Kayode Apalowo,
Mohamad Aizat Abas,
Muhamed Abdul Fatah Muhamed Mukhtar
et al.

Abstract: Purpose This study aims to investigate the reliability issues of microvoid cracks in solder joint packages exposed to thermal cycling fatigue. Design/methodology/approach The specimens are subjected to JEDEC preconditioning level 1 (85 °C/85%RH/168 h) with five times reflow at 270°C. This is followed by thermal cycling from 0°C to 100°C, per IPC-7351B standards. The specimens' cross-sections are inspected for crack growth and propagation under backscattered scanning electronic microscopy. The decoupled therm… Show more

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