2020
DOI: 10.1016/j.ijheatmasstransfer.2019.118855
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Numerical investigations of fin efficacy for phase change material (PCM) based thermal control module

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Cited by 83 publications
(18 citation statements)
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“…In addition, during solidification, no effect of fin insertion was reported. A numerical study was developed by Desai et al 35 to find the optimal configuration that limits the critical temperature rise of the electronic component. The parameters studied are the size, number, shape, and mass percentage of the fins.…”
Section: Application Of Pcm In the Thermal Management Of Electronic Cmentioning
confidence: 99%
“…In addition, during solidification, no effect of fin insertion was reported. A numerical study was developed by Desai et al 35 to find the optimal configuration that limits the critical temperature rise of the electronic component. The parameters studied are the size, number, shape, and mass percentage of the fins.…”
Section: Application Of Pcm In the Thermal Management Of Electronic Cmentioning
confidence: 99%
“…Second, the thermophysical properties of phase transition in PCMs allow for minimal or no temperature stratification; thus, the temperature during operation can remain almost unchanged. Therefore, PCMs find significant applications in the fields of energy savings in buildings [16][17][18][19], load management in district cooling utilities [20,21] and peak shaving in plants of renewable energy [22][23][24].…”
Section: Introductionmentioning
confidence: 99%
“…The MEPCM exhibited a high melting point above 500 °C, high heat storage density of 180 J g −1 or higher, and durability over 3000 cycles. Furthermore, microscale encapsulation provided beneficial properties for thermal control: miniaturization of the PCM enabled rapid melting of the internal alloy 2 , and expansion of the heat exchange area provided rapid thermal response 20 .…”
Section: Introductionmentioning
confidence: 99%