Numerical modeling of silicon etching in CF/sub 4//O/sub 2/ plasma-chemical system

Grigoryev, Yu. N.; Gorobchuk, A. G.

doi:10.1109/icmel.2004.1314866

Cited by 2 publications

(3 citation statements)

References 7 publications

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“…In first turn some characteristic features of authors' numerical model of plasma etching process will be described. The numerical model was developed during several years with successive improving its adequacy and prognostic abilities step by step (Grigoryev & Gorobchuk, 1996;Grigoryev & Gorobchuk, 1997;Grigoryev & Gorobchuk, 1998;Shokin et al, 1999;Grigoryev & Gorobchuk, 2004;Grigoryev & Gorobchuk, 2007;Grigoryev & Gorobchuk, 2008). Today the created model corresponds completely to the world standards in mathematical modelling of plasma reactors and includes some novel elements.…”

Section: Numerical Model Formulationmentioning

confidence: 99%

Micro Electronic and Mechanical Systems

Takahata¹

2009

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and 2005, respectively. He held industrial research positions with Panasonic in Japan and 3M in USA, conducting R&D of micro devices and fabrication technologies for over ten years. Presently, he is an Assistant Professor at the University of British Columbia, Canada, as well as a Canada Research Chair. Prof. Takahata has published many papers and holds several issued patents in MEMS and micro/nanofabrication. He has served on committees for international conferences such as the IEEE MEMS and the IEEE Transducers. He also served as the editor of an InTech book Micro Electronic and Mechanical Systems. His research interests are in the areas of MEMS, nanotechnology, and micro/nanomanufacturing, including wireless microdevices, bioMEMS, nanomaterials and microstructures integration, and microplasma control and application. PrefaceThe miniaturization and performance improvement in semiconductor devices and integrated circuits (ICs) are expected to continue through leveraging of nanotechnologies and nanomaterials. This evolution should accelerate the System-on-a-Chip (SoC) trend, i.e., singlechip integration of multifunctional, mixed-signal electronic components, toward realizing embedded nanoelectronic systems. In parallel with advances in electronics, we are witnessing the rise of micro-electro-mechanical systems (MEMS), with rapidly growing commercial opportunities and markets extending to a broader range of industrial sectors on a global scale.The emergence of MEMS is primarily attributed to the establishment of sophisticated IC manufacturing techniques and processes that served as a foundation for realizing many innovative silicon-based micromachining technologies. Advances in this area have brought about a revolution in mechanical engineering, enabling the miniaturization and system-level integration of mechanical structures and devices with ICs on a chip for MEMS fabrication. With miniaturized sensors and actuators, MEMS provide us with the ability to interact with micro-scale environments with non-electrical/-electronic parameters, found in the mechanical, optical, chemical, biological, and other domains. This exceptional ability has led to their application in fields ranging from implantable medical sensors to video game controllers. There is no doubt that continued development of MEMS and microsystems with electromechanical functionalities will extend their contribution to society, in parallel with the evolution of IC technologies.This book discusses key aspects of these technology areas, organized in twenty-seven chapters that present the latest research developments in micro electronic and mechanical systems. The book addresses a wide range of fundamental and practical issues related to MEMS, advanced metal-oxide-semiconductor (MOS) and complementary MOS (CMOS) devices, SoC technology, integrated circuit testing and verification, and other important topics in the field. Several chapters cover state-of-the-art microfabrication techniques and materials as enabling technologies for the microsystems. Reliabili...

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Section: Numerical Model Formulationmentioning

confidence: 99%

Micro Electronic and Mechanical Systems

Takahata¹

2009

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“…The numerical model was developed during several years with successive improving its adequacy and prognostic abilities step by step (Grigoryev & Gorobchuk, 1996;Grigoryev & Gorobchuk, 1997;Grigoryev & Gorobchuk, 1998;Shokin et al, 1999;Grigoryev & Gorobchuk, 2004;Grigoryev & Gorobchuk, 2007;Grigoryev & Gorobchuk, 2008). Today the created model corresponds completely to the world standards in mathematical modelling of plasma reactors and includes some novel elements.…”

Section: Numerical Model Formulationmentioning

confidence: 99%

“…In general case a binary mixture CF 4 /O 2 was considered as a parent gas because it is widely spread in silicon technology (Grigoryev & Gorobchuk, 2004;Grigoryev & Gorobchuk, 2007). An important difficulty for CF 4 /O 2 system is a simulation of plasma-chemical kinetics which is extraordinarily complicated.…”

Section: Physical-chemical Kinetics and Species Concentration Distribmentioning

confidence: 99%

Numerical Simulation of Plasma-Chemical Processing Semiconductors

Grigoryev¹,

Gorobchuk²

2009

Micro Electronic and Mechanical Systems

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Numerical modeling of silicon etching in CF/sub 4//O/sub 2/ plasma-chemical system

Cited by 2 publications

References 7 publications

Micro Electronic and Mechanical Systems

Micro Electronic and Mechanical Systems

Numerical Simulation of Plasma-Chemical Processing Semiconductors

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