“…The numerical model of fluid and heat flow in the considered ceiling panel was developed and presented in detail by Jaworski et al and Łapka et al The model consists of two parts: the first one—3D—which accounts for heat transfer and phase change phenomena in the solid body of the panel, ie, in the gypsum‐microencapsulated PCM composite, and the second one—1D—which deals with fluid flow and heat transfer in air flowing through the U‐shaped channel. The energy equation for the 3D heat flow and phase change process in the composite material was the following: while the governing equation for the 1D incompressible air flow through the U‐shaped channel was as follows: where A c is the cross section area of the channel, c p is the specific heat, h i is the heat transfer coefficient at internal walls of the channel, k is the thermal conductivity, P c is the perimeter of the channel, t is the time, T is the temperature, T w , m is the temperature of the wall of the channel averaged over the perimeter, u is the air velocity, x is the coordinate along the U‐shaped channel, and ρ is the density.…”