Numerical optimization of dielectric properties to achieve process uniformity in capacitively coupled plasma reactors
Ho Jun Kim,
Kyungjun Lee,
Hwanyeol Park
Abstract:This paper presents the results of our numerical analysis to optimize the dielectric properties to achieve process uniformity in the thin film deposition process using capacitively coupled plasma. The difference in the plasma density distribution was analyzed by changing the wafer material from silicon to quartz (or Teflon). Similarly, aluminum was compared with aluminum nitride as the electrode material, and the sidewall material was varied from quartz to a perfect dielectric to study the effect on the plasma… Show more
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