Numerical Simulation and Thermal Failure Analysis of SOM Package

Kim, Jae Choon; Chung, Jin Taek; Lee, Won Suk; Kim, Gyoung Bum; Lee, Dong Jin; Cho, Ji-Man; Yu, Ji-Hyuk; Ju, Byeong−Kwon; Hang, Sung Woo; Park, Heung-Woo; Yun, Sangwoon

doi:10.1109/esime.2007.359958

Cited by 2 publications

(1 citation statement)

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“…Emissivity equalization was used to produce an accurate temperature image [5]. The relationship between temperatures of the glass substrate and the deformable mirror module was acquired through experimental and numerical analyses [6] that showed a temperature difference of 0.1 C between the glass substrate and deformable mirror module. Fig.…”

Section: B Analysis Of Thermal Characteristics Of Packagementioning

confidence: 99%

IEEE Components, Packaging, and Manufacturing Technology Society information for authors

2011

IEEE Trans. Compon., Packag. Manufact. Technol.

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A piezo-actuated display package (PADP) with deformable mirror arrays is proposed for handheld applications of a micro-beam projection display. Temperature change is a critical factor affecting the performance of a PADP. To analyze temperature-related malfunctions, electrical, mechanical, and thermal analyses of the package are conducted simultaneously. A temperature control system using a micro-heater is developed to maintain the deformable mirror module at a constant temperature. Numerical results are used to determine the relationship between displacement and the temperature of the deformable mirrors. Experimental results are used to elucidate the relationship between the source image data and the temperature of the deformable mirror module. A micro-beam projector with a temperature control system is used to produce high quality images under various ambient temperatures.Index Terms-Deformable mirror arrays, micro-beam projector, temperature control.

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Section: B Analysis Of Thermal Characteristics Of Packagementioning

confidence: 99%