2009
DOI: 10.1016/j.applthermaleng.2008.12.009
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Numerical simulation of a heat sink embedded with a vapor chamber and calculation of effective thermal conductivity of a vapor chamber

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Cited by 68 publications
(26 citation statements)
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“…To reduce computational cost, a simplified transient, three-dimensional model intended for implementation into system-level models was developed by Chen et al [111]. The linear model assumed negligible thermal resistance due to vapor convection, and treated the vapor as a common interface between the evaporator and condenser wicks; the utility and accuracy of the model were later demonstrated through analysis of a complete thermal heat sink package with an embedded vapor chamber [112]. Additional detailed, three-dimensional numerical models that solved for flow and heat transport in vapor chambers were presented by Koito et al [113] and Xiao and Faghri [114].…”
Section: Numerical Modeling Approachesmentioning
confidence: 99%
“…To reduce computational cost, a simplified transient, three-dimensional model intended for implementation into system-level models was developed by Chen et al [111]. The linear model assumed negligible thermal resistance due to vapor convection, and treated the vapor as a common interface between the evaporator and condenser wicks; the utility and accuracy of the model were later demonstrated through analysis of a complete thermal heat sink package with an embedded vapor chamber [112]. Additional detailed, three-dimensional numerical models that solved for flow and heat transport in vapor chambers were presented by Koito et al [113] and Xiao and Faghri [114].…”
Section: Numerical Modeling Approachesmentioning
confidence: 99%
“…Chang et al [8] experimentally investigated the effects of the evaporation surfaces, fill ratios of working fluid and input heating powers on the thermal performance of the heat pipe cooling system with the thermal resistance model. Chen et al [9] presented a numerical investigation of a plate-fin heat sink embedded with a vapor chamber, subject to the influence of concentrated heat sources. Zhang et al [10] numerically and experimentally investigated the flat two-phase thermosyphon.…”
Section: Introductionmentioning
confidence: 99%
“…The vapor is substituted with a domain that has very large thermal conductivity. [2,19,41] Thereby the model will become purely conduction based and will be much simpler to solve.…”
Section: Vapor Chamber Simulationmentioning
confidence: 99%
“…Simplified models have been created to resolve this problem. [1,2] However, most of them divide the vapor chamber into functional sections like the wall, the wick and the vapor space. This creates a model that can represent well the mathematical properties of the vapor chamber, but sometimes these can be hard to integrate into existing software.…”
Section: Introductionmentioning
confidence: 99%