2009
DOI: 10.3139/217.2227
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Numerical Simulation of a Thermoviscoelastic Frictional Problem with Application to the Hot-Embossing Process for Manufacturing of Microcomponents

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Cited by 6 publications
(5 citation statements)
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“…Selfassembled n-octadecyltrichlorosilane was also used to coat Si mold for the reduction of adhesion between the mold and patterned polymers [75,76]. The problem of frictional contact during demolding stage was simulated by Kabanemi et al [77]. A modified Coulomb's law of dry friction was used and the friction was demonstrated to strongly influence the overall deformation during cooling the inside mold.…”
Section: Process Study Of P2p Micro Hot Embossingmentioning
confidence: 99%
“…Selfassembled n-octadecyltrichlorosilane was also used to coat Si mold for the reduction of adhesion between the mold and patterned polymers [75,76]. The problem of frictional contact during demolding stage was simulated by Kabanemi et al [77]. A modified Coulomb's law of dry friction was used and the friction was demonstrated to strongly influence the overall deformation during cooling the inside mold.…”
Section: Process Study Of P2p Micro Hot Embossingmentioning
confidence: 99%
“…An automatic procedure has been developed in order to track the nonlinear boundary conditions at the interface. We adopt here the procedure developed by Brunet and Kabanemi et al . In that procedure, the decision on whether a contact node is releasing or is in sticking or sliding condition is based on the following decision tree: If f n ≥ 0 the node is assumed to have experienced tension and in this case the penalty parameters and the normal and tangential contact force are set to zero, to release the node. If f n < 0 and ∣ f t ∣ < μ s ∣ f n ∣ the node continues to stick and Eqs .…”
Section: Mathematical Formulationmentioning
confidence: 99%
“…An automatic procedure has been developed in order to track the nonlinear boundary conditions at the interface. We adopt here the procedure developed by Brunet [26] and Kabanemi et al [27]. In that procedure, the decision on whether a contact node is releasing or is in sticking or sliding condition is based on the following decision tree:…”
Section: Solution Procedures For the Contact Problem Between Parison Amentioning
confidence: 99%
“…The relationship between demolding, feature geometry, and demolding temperature has been widely investigated (Dirckx & Hardt, 2011;Kabanemi et al, 2009;Saha et al, 2011). Thirdly, recovery may occur after separating the mold and the substrate, causing stability problems of embossing features.…”
Section: P2p Hot Embossingmentioning
confidence: 99%