Numerical Simulation of Film Thickness Uniformity Deposited by Planar Circular Magnetron Sputtering System

Abstract

There exist angular offset and eccentricity between target and substrate in most practical multi-target magnetron sputtering systems, which should be seriously considered when we calculate the film distribution. This simulation results suggested that excellent thickness uniformity can be obtained when increased the substrate-target distance, angular offset, and eccentricity, but decreased the film thickness simultaneously. However, superior uniformity films without reducing the thickness remarkably can also obtained when the geometry configuration are proper configured.

Realizing Ultrauniform Films at Wafer Scale through the Magnetron Sputtering Method

“…As an important deposition technique, magnetron sputtering (MS) has been widely applied for the preparation of various films. − It owns several advantages, including compatibility with the complementary metal-oxide-semiconductor transistor (CMOS) process, high deposition rate, excellent quality, good controllability, and environmental friendliness. , Generally, the nonuniformity of film thickness is a critical factor in high-precision electrical and optical applications, such as gravitational wave detection reflectors, optical filters, , thermochromic glass, optical components in microscopy, and the electrode layer in resonators. , Moreover, the fabrication of large-sized multilayer mirrors for extreme ultraviolet, soft X-ray, and X-ray applications typically requires ultrauniform films …”

“…6,12 Moreover, the fabrication of large-sized multilayer mirrors for extreme ultraviolet, soft Xray, and X-ray applications typically requires ultrauniform films. 13 To improve the thickness uniformity of sputtered films, researchers have conducted numerous experimental efforts, such as adjusting the arrangement of magnetic circuits, 14 designing the shape of baffle plates, 15 regulating the relative position of the target and the substrate, 16 reforming the motion mode of the substrate, 17,18 and optimizing the process parameters. 19,20 For instance, Zhong et al 21 enhanced the thickness uniformity of aluminum films on 200 mm chips by increasing the process pressure.…”