Numerical Simulation of the Evolution of Stress in Solar Cells During the Entire Manufacturing Cycle of a Conventional Silicon Wafer Based Photovoltaic Laminate

Thermo-mechanical behavior assessment of smart wire connected and busbarPV modules during production, transportation, and subsequent field loading stages

“…The thermo-mechanical behavior of busbar PV module during manufacturing and subsequent life stages has been investigated in these studies: manufacturing process is analyzed by studies [9][10][11][12][13][14][15][16]; cracking effect on output or behavior is analyzed by studies [17][18][19][20][21][22]; behavior during application of different kind of loads is analyzed by studies [1,13,[21][22][23][24][25][26][27][28]. However, the existing studies did not include the initial stresses or pre-stresses in their analysis except studies [9,11,16], but they [9,11,16] studied production stage only. The residual stress in a PV module is the result of the aggregation of residual stresses from each life stage [9] and the literature review shows lack of module behavior study covering its entire life.…”

“…However, the existing studies did not include the initial stresses or pre-stresses in their analysis except studies [9,11,16], but they [9,11,16] studied production stage only. The residual stress in a PV module is the result of the aggregation of residual stresses from each life stage [9] and the literature review shows lack of module behavior study covering its entire life. Therefore, a comprehensive study covering the thermo-mechanical aspects during the entire busbar PV module life in a consecutive step-by-step manner is required to gain a better understanding about module behavior.…”

“…Linear thermal expansion coefficients of silicon between 4 K to 340 K, 340 K to 850 K, 850 K to 1500 K are taken from literatures [37,38, and 39] respectively. Song et al [9] recommended to consider the copper as elastoplastic material. According to Tippabhotla et al [11], consideration of copper as just linear elastic material causes over prediction of results, as stiffness changes of inter-connector could not be accommodated upon yielding.…”

Optimizing Optical Film Lamination to Enhance the Luminance of TFT-LCD Displays Using the Taguchi-NNGA Method

“…Ridhuan et al [ 3 ] studied the effect of interconnecting thickness and yield strength to find maximum peak stress in the longitudinal cross-section of a photovoltaic (PV) laminate during the soldering and lamination processes. For determining the accumulated final residual stresses in a PV laminate, Song et al [ 4 ] simulated the stress evolution of solar cells in manufacturing a conventional silicon wafer-based photovoltaic laminate.…”

Residual stress analysis of thin film photovoltaic cells subjected to massive micro-particle impact

“…The results indicated that a signicant increase of residual stress in the silicon cell near the solder joint would be induced aer lamination and the results by FE simulations indicated the increase of stress during lamination was a result of highly localized bending of the cell near the soldered inter-connects. Song et al 29,30 investigated the evolution of stresses in solar cells throughout the manufacturing cycle of a conventional PV laminate. They found that stresses in the cells during the pressure-ramping step of the lamination process are determined and found to be the most critical in the entire PV laminate manufacturing cycle.…”