Numerical Simulation of Thermal Effects in Coupled Optoelectronic Device-circuit Systems

Brunk, Markus; Jüngel, Ansgar

doi:10.1007/978-3-540-77203-3_4

Cited by 1 publication

(1 citation statement)

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“…Caused by the decreasing physical size and increasing packing density and operating frequency, such devices cannot be modeled by lumped equivalent circuits anymore. Therefore, the need for simulation tools and new models reflecting the complex continuous processes in semiconductors in more details is growing (e.g., ). An approach for modeling the semiconductor devices in the circuit relies on the drift‐diffusion equations coupled to the network equations .…”

Section: Introductionmentioning

confidence: 99%

Model order reduction of coupled circuit‐device systems

Hinze

Kunkel

Steinbrecher

et al. 2012

Int J Numerical Modelling

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SUMMARY We consider model order reduction of integrated circuits with semiconductor devices. Such circuits are modeled using modified nodal analysis by differential‐algebraic equations coupled with the nonlinear drift‐diffusion equations. A spatial discretization of these equations with a mixed finite element method yields a high dimensional nonlinear system of differential‐algebraic equations. Balancing‐related model reduction is used to reduce the dimension of the decoupled linear network equations, whereas the semidiscretized semiconductor model is reduced using proper orthogonal decomposition. Because the computational complexity of the reduced‐order model through the nonlinearity of the drift‐diffusion equations still depends on the number of variables of the full model, we apply the discrete empirical interpolation method to further reduce the computational complexity. We provide numerical comparisons that demonstrate the performance of the presented model reduction approach. Copyright © 2012 John Wiley & Sons, Ltd.

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Section: Introductionmentioning

confidence: 99%