Numerical simulations and optimized design on the performance and thermal stress of a thermoelectric cooler

Zhang, Jingshuang; Zhao, Huadong; Feng, Bo; Song, Xiaohui; Zhang, Xiang; Zhang, Rui

doi:10.1016/j.ijrefrig.2022.11.010

Cited by 14 publications

(8 citation statements)

References 31 publications

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“…The heat flux and current density are coupled by three basic TE effects, [ 44 ] and the corresponding thermodynamic relationships can be expressed as follows [ 7,20 ] :

\nabla (\kappa \nabla T)+\frac{{{\boldsymbol{J}}}^{2}}{\sigma }-T{\boldsymbol{J}}\cdot \left[\left(\frac{\partial \alpha }{\partial T}\right)\nabla T+{(\nabla \alpha )}_{T}\right]=0,

\nabla \cdot {\boldsymbol{J}}=0,

{\boldsymbol{J}}=-\sigma (\nabla V+\alpha \nabla T),

{\boldsymbol{q}}=\alpha T{\boldsymbol{J}}-\kappa \nabla T,

where α is the Seebeck coefficient, κ is the thermal conductivity, σ is the electrical conductivity, T is the absolute temperature, V is the electrostatic potential, and the vectors J and q represent the current density and heat flux density, respectively. Among them, α , κ , and σ are all dependent on temperature.…”

Section: Methodsmentioning

confidence: 99%

“…The heat flux and current density are coupled by three basic TE effects, [44] and the corresponding thermodynamic relationships can be expressed as follows [7,20] :…”

Section: Boundary Conditions Settingmentioning

confidence: 99%

“…[11][12][13][14][15] The micro thermoelectric thermostat (micro-TET) can utilize the Peltier effect to actively pump heat and switch between cooling (micro-TEC) and heating (micro-TEH) functions simply by altering the direction of the current, enabling precise temperature control of the area (Figure 1A). [16][17][18][19] As it is a solid-state device with no moving parts, no maintenance requirements, no noise production, and is easily integrated with other electronic components, [20][21][22][23][24][25] it has become a popular choice for thermal management in daily life and industry. [26][27][28][29][30][31][32][33] Xu et al [34] developed a flexible TE cooler with a four-layered structure of "Ag 2 Se/poly (3,4-ethylenedioxythiophene) polystyrene sulfonate" for human skin thermal management.…”

mentioning

confidence: 99%

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Multifactor roadmap for designing low‐power‐consumed micro thermoelectric thermostats in a closed‐loop integrated 5G optical module

Yang,

Xing,

Wang

et al. 2024

Interdisciplinary Materials

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As the core components of fifth‐generation (5G) communication technology, optical modules should be consistently miniaturized in size while improving their level of integration. This inevitably leads to a dramatic spike in power consumption and a consequent increase in heat flow density when operating in a confined space. To ensure a successful start‐up and operation of 5G optical modules, active cooling and precise temperature control via the Peltier effect in confined space is essential yet challenging. In this work, p‐type Bi0.5Sb1.5Te3 and n‐type Bi2Te2.7Se0.3 bulk thermoelectric (TE) materials are used, and a micro thermoelectric thermostat (micro‐TET) (device size, 2 × 9.3 × 1.1 mm3; leg size, 0.4 × 0.4 × 0.5 mm3; number of legs, 44) is successfully integrated into a 5G optical module with Quad Small Form Pluggable 28 interface. As a result, the internal temperature of this kind of optical module is always maintained at 45.7°C and the optical power is up to 7.4 dBm. Furthermore, a multifactor design roadmap is created based on a 3D numerical model using the ANSYS finite element method, taking into account the number of legs (N), leg width (W), leg length (L), filling atmosphere, electric contact resistance (Rec), thermal contact resistance (Rtc), ambient temperature (Ta), and the heat generated by the laser source (QL). It facilitates the integrated fabrication of micro‐TET, and shows the way to enhance packaging and performance under different operating conditions. According to the roadmap, the micro‐TET (2 × 9.3 × 1 mm3, W = 0.3 mm, L = 0.4 mm, N = 68 legs) is fabricated and consumes only 0.89 W in cooling mode (QL = 0.7 W, Ta = 80°C) and 0.36 W in heating mode (Ta = 0°C) to maintain the laser temperature of 50°C. This research will hopefully be applied to other microprocessors for precise temperature control and integrated manufacturing.

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“…The heat flux and current density are coupled by three basic TE effects, [ 44 ] and the corresponding thermodynamic relationships can be expressed as follows [ 7,20 ] :

\nabla (\kappa \nabla T)+\frac{{{\boldsymbol{J}}}^{2}}{\sigma }-T{\boldsymbol{J}}\cdot \left[\left(\frac{\partial \alpha }{\partial T}\right)\nabla T+{(\nabla \alpha )}_{T}\right]=0,

\nabla \cdot {\boldsymbol{J}}=0,

{\boldsymbol{J}}=-\sigma (\nabla V+\alpha \nabla T),

{\boldsymbol{q}}=\alpha T{\boldsymbol{J}}-\kappa \nabla T,

Section: Methodsmentioning

confidence: 99%

“…The heat flux and current density are coupled by three basic TE effects, [44] and the corresponding thermodynamic relationships can be expressed as follows [7,20] :…”

Section: Boundary Conditions Settingmentioning

confidence: 99%

mentioning

confidence: 99%

See 1 more Smart Citation

Multifactor roadmap for designing low‐power‐consumed micro thermoelectric thermostats in a closed‐loop integrated 5G optical module

Yang,

Xing,

Wang

et al. 2024

Interdisciplinary Materials

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show abstract

“…Interestingly, the current corresponding to the maximum device cooling performance remains the same at ∼14 mA in both cases because the via dimensions remain unchanged. 31 The cooling capacity for both the cases (free-standing micro-TEC pillars and SimTEC vias) increase with an increase in the pillar/ via pitch mainly due to the decrease in ΔT max , as the current corresponding to maximum cooling remains the same (Table 6).…”

Section: Effect Of Simtec Via Pitchmentioning

confidence: 97%

Substrate integrated micro-thermoelectric coolers in glass substrate for next-generation photonic packages

Gupta,

Tanwar,

et al. 2024

J. Optical Microsystems

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Managing the temperature of photonic chips within intricate electro-optic packages poses a notable challenge concerning the thermal crosstalk between the photonic chip, electronic chip, and the chip-fiber connection point. This is a multifaceted problem and requires packaging solutions that cannot only address high-performance thermal management but must also be scalable to high volumes. Glass has long been thought of as a suitable platform for next-generation photonic packaging due to its low thermal conductivity, which minimizes unwanted heat transfer between electronic and photonic components. Achieving proper thermal isolation between the chips and the chip-fiber interface necessitates a microscale thermal solution that guarantees accurate temperature regulation of the photonic circuitry without disrupting the optical coupling interface with the fiber array, due to the presence of epoxy used for fiber attachment. We propose a technique for the development of a substrate-integrated microthermoelectric cooler (SimTEC) for the effective temperature control of the electronic and photonic integrated devices. The proposed device uses glass substrate vias that are half-filled with p and n-type thermoelectric materials and the other half with copper. A COMSOL multiphysics model is developed to study the variations in the cooling performance of this SimTEC device based on changes in the via parameters. Interestingly, the maximum range of temperature gradient variation for SimTEC is 6 times greater compared to that of equivalent free-standing micro-TEC pillars. However, there are some challenges associated with implementing this method, as the temperature gradient (or cooling effect) achieved by SimTEC still falls short of that achieved by the free-standing micro-TEC pillars.

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“…A considerable number of series-connected thermoelements in the cooler allowed considering the failure rate as a constant value with sufficient accuracy [9]. This provided obtaining of analytical connection of reliability indexes with structural [10,11], mechanical [12,13], thermal [14], technological and power [15] indexes. The result of this research was development of mathematical model of thermoelectric cooler [16], which quantitatively connects failure rate with design and energy indices.…”

Section: Literature Reviewmentioning

confidence: 99%

Reliability control of a thermoelectric cooler with changes in ambient temperature

Zaykov¹,

Mescheryakov²,

Zhuravlov³

2023

HAIT

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The paper presents the development of method of thermoelectric system reliability indexes control for providing thermal modesof radio electronic equipment, based on thermoelectric coolers medium temperature variation. A mathematical model for investigating influence of the environment temperature variation on the reliability performance of a single-cascade thermoelectric cooler at a given temperature level of cooling, thermal load, geometry of thermoelement branches for different characteristiccurrent operating modes is considered. The results of calculations of the basic parameters, reliability indices, dynamic characteristicsand the analysis of dependences are given for revealing the peculiarities of control processes. It is shown that decreasing the medium temperature at a given chiller design decreases the operating current, increases the cold-productivity, and decreases the time of reaching a steady-state operating mode for various characteristic current operating modes. The time to steady-state operation decreases from the minimum failure rate to the maximum cooling capacity at a fixed medium temperature. The minimum steady-state operation time is ensured in maximum cooling capacity mode. Reduction of such significant for control indices as the amountof consumed energy for different characteristic current operation modes, required heat dissipation capacity of the radiator, time of reaching the steady-state mode is noted. Analysis of research results has shown that it is possible to control indicators of reliability of a single-stage cooler of a given design by changing the medium temperature by changing the value of operating current. A change in the medium temperature of the thermoelectric cooler due to an external supporting device makes it possible to vary the reliability indices and to find a compromise between the reliability, dynamics and cooling capacity of the thermal mode support system.

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Numerical simulations and optimized design on the performance and thermal stress of a thermoelectric cooler

Cited by 14 publications

References 31 publications

Multifactor roadmap for designing low‐power‐consumed micro thermoelectric thermostats in a closed‐loop integrated 5G optical module

Multifactor roadmap for designing low‐power‐consumed micro thermoelectric thermostats in a closed‐loop integrated 5G optical module

Substrate integrated micro-thermoelectric coolers in glass substrate for next-generation photonic packages

Reliability control of a thermoelectric cooler with changes in ambient temperature

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