Numerical study of atomic scale deformation mechanisms of Ti grains with different crystallographic orientation subjected to scratch testing

Recovery of Scratch Grooves in Ti-6Al-4V Alloy Caused by Reversible Phase Transformations

“…Metals 2020, 10, x FOR PEER REVIEW 4 of 14 atom. The coefficient k was chosen to be equal to 10 eV/Å 3 , similar to the earlier works [16,25,26]. The vertical immersion of the indenter into the crystallite was not considered.…”

“…Thus, atoms whose distance was less than the equilibrium radius R were acted upon by a force directed from the force center, equal to F = −k(R − r) 2 , where k is the coefficient reflecting tip stiffness and r is the distance between the centers of the indenter and the atom. The coefficient k was chosen to be equal to 10 eV/Å 3 , similar to the earlier works [16,25,26]. The vertical immersion of the indenter into the crystallite was not considered.…”

“…Alhafez et al [25] used MD simulation to study the defect generation and plasticity in HCP crystals, with the basal and prismatic planes as the surfaces subjected to scratching by a hard tip. The authors' MD simulation showed that in the course of the scratching of Ti crystals, there is extensive defect-generation in the surface layers of the materials that is followed by the formation of disordered nanodomains [16,26]. The improvement of computer performance has promoted MD simulations of scratch testing of nanosized polycrystals [27,28], amorphous materials [29] and layered materials [30].…”

VLIJaNIE GRANIC ZEREN NA OSOBENNOSTI PLASTIChESKOGO OTTESNENIJa MATERIALA V KRISTALLITAH TITANA PRI SKRETCh TESTIROVANII

“…Секция 3. Проблемы компьютерного конструирования материалов с иерархической структурой DOI: 10.17223/9785946218412/134 ВЛИЯНИЕ ГРАНИЦ ЗЕРЕН НА ОСОБЕННОСТИ ПЛАСТИЧЕСКОГО ОТТЕСНЕНИЯ МАТЕРИАЛА В КРИСТАЛЛИТАХ ТИТАНА ПРИ СКРЕТЧ ТЕСТИРОВАНИИ 1,2 Дмитриев А.И., 1,2 Никонов А.Ю., 1 Шугуров А.Р. 1 Институт физики прочности и материаловедения СО РАН, Томск 2 Томский государственный университет, Томск…”

“…Проанализированы особенности пластического оттеснения материала при прохождении индентора через межзеренные границы и плоскости двойников. В отличие от предыдущих исследований [1], основное внимание в настоящей работе уделено закономерностям взаимодействия индентора с границами двойников когерентного и некогерентного типа. Показано, что при нагружении двойника, с когерентными границами наблюдается значительное их искривление, вызванное деформационным воздействием.…”