Numerical study of the gas flow velocity space in convection reflow oven

Illés, Béla; Bakó, István

doi:10.1016/j.ijheatmasstransfer.2013.10.075

Cited by 38 publications

(11 citation statements)

References 20 publications

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“…VPS now is also considered as an environmentally friendly solution for reflow soldering, while it is efficient from the point of energy consumption, and the applied chemical (the Galden) is harmless and environmental friendly. The main advantages of the VPS process (compared to the regular reflow soldering technologies) are the uniform heating of the soldered assembly where the temperature is limited to the boiling point of the Galden liquid (Huang and Zhang, 2015); the inert atmosphere (fluxes with lower activation level can be used (Coombs and Freedman, 2008) and the condensed film layer keeping the oxygen and other gases from direct contact of the solder paste; and the lack of shadowing effect of larger components on small ones (Illés and Bak o, 2014). As the condensation has around 2-3 times higher heat transfer coefficient than forced convection, considerable disadvantage is the rapid heating, which may cause damage in the solder assembly (popcorn effect, and delamination of plastic packaging (Lee and Earmme, 1998).…”

Section: Introductionmentioning

confidence: 99%

Vapour phase soldering (VPS) technology: a review

Illés

Géczy

Medgyes

et al. 2019

SSMT

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Purpose: This paper presents a review of the recent developments about the vapour phase soldering technology. This study focuses on the fallowing topics: recent developments of the technology (like soft and vacuum vapour phase soldering); measurement and characterization methods of vapour space (temperature and pressure); numerical simulation of the VPS soldering process (like condensate layer and solder joint formation); and quality and reliability studies of the solder joints prepared by VPS (like void content and microstructure of the solder joints). Design/methodology/approach: This study was written according to the results of a worldwide literature review about the substantial previous works in the past decade and according to the own results and experiences of authors from around the globe. Findings: Up to now, a part of the electronics industry believes that the reflow soldering with VPS method is a significant alternative of convection and infrared technologies. The summarized results of the field in this study supports this idea. Research limitations/implications: This literature review provides engineers and researchers with understanding the limitations and application possibilities of the VPS technology and the current challenges in soldering technology. Originality/value: Our paper summarizes the most important advantages of VPS technology compared to the other reflow soldering methods as well as points out the necessary further developments and possible research directions

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Section: Introductionmentioning

confidence: 99%

Vapour phase soldering (VPS) technology: a review

Illés

Géczy

Medgyes

et al. 2019

SSMT

Self Cite

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“…e surface temperature of the motherboard on flexible printed circuit boards was predicted using the simulation software ANSYS, though the reliability of the results still needs further experimental verification [14]. By applying simulation software, the computational fluid dynamics (CFD) models of reflow soldering were also tried [10][11][12]15]. On the other hand, as the reflow soldering model becomes more accurate, on the basis of the temperature profile, the evaluation of soldering quality and optimization of relevant parameters, such as the heat transfer coefficient, heat flow, and reflux cooling time, have gradually been developed [5,16].…”

Section: Introductionmentioning

confidence: 99%

Effects of the Solder Phase Transformation on the Optimization of Reflow Soldering Parameters and Temperature Profiles

Liu

Zhang

2021

Discrete Dynamics in Nature and Society

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In this study, a heat convection model of the reflow oven and a heat conduction model of the soldering area are proposed based on heat transfer theory, and a dynamic Thomas algorithm is developed for solving linear equations with coefficient matrix evolving over time in the tridiagonal system, which is derived from a heat transfer problem with moving boundaries in the solder phase transition process. We have also carried out numerical simulations for investigating the accuracy of the mathematical model, in which the temperature profiles are calculated and compared for different cases with considering or ignoring phase transformations, respectively. Parameters of reflow soldering, such as the conveyor speed, the set temperature in each zone, and a part of the heating factor, are optimized by the use of the nondominated sorting genetic algorithm II. By comparing the temperature profile and optimal solutions in the two cases, numerical results show that phase transitions of the solder have great impacts on optimal parameters and the slope of temperature profiles. Moreover, the phenomenon that the heating factor varies with the maximum set temperature in a banded distribution is investigated and analyzed, which is an important part of this work.

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“…Vapour Phase Soldering (VPS) is a reflow soldering method, which is more complex from the aspect of heat transfer than conventional convection- [1,2,3], or IR heating [4] based reflow processes.…”

Section: Introductionmentioning

confidence: 99%

Refined Approach on Controlling Heat Transfer in a Vapour Phase Soldering Oven

Géczy

Kiss

Alaya

et al. 2019

2019 42nd International Spring Seminar on Electronics Technology (ISSE)

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The control of soldering temperature profiles is crucial in any reflow process of electronic assemblies. In our paper a novel approach is presented on the control of the temperature during vapour phase soldering process. In the given case the electronic surface mounted assembly to be soldered is immersed into the vapour with a special sample holder system and moved up and down by a flexible LabVIEW hardware and software configuration. It was found that with proper data acquisition and appropriate programming, the system is able to follow pre-programmed soldering profiles with small deviation. The paper presents the system, the experimental configuration and initial results obtained with the setup. The proposed setup can improve the current view on proper heat transfer handling in VPS ovens, and also enables precise control on investigations with different low-temperature solder alloys, and most importantly, thermally sensitive substrates, such as biodegradable epoxies, or moulded interconnect devices.

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Numerical study of the gas flow velocity space in convection reflow oven

Cited by 38 publications

References 20 publications

Vapour phase soldering (VPS) technology: a review

Vapour phase soldering (VPS) technology: a review

Effects of the Solder Phase Transformation on the Optimization of Reflow Soldering Parameters and Temperature Profiles

Refined Approach on Controlling Heat Transfer in a Vapour Phase Soldering Oven

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