Numerical Study on Microchannel Heat Sink with Asymmetric Leaf Pattern

Gaikwad, Vinayak; Ghogare, S. D.; Mohite, Suhas S.

doi:10.1007/978-3-319-53556-2_49

Cited by 2 publications

(2 citation statements)

References 6 publications

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“…Nevertheless, some unconventional shapes also attract people's attention. Some biomimetic patterns such as leaf [65], snowflake and spiderweb [66] have been investigated and found to be efficient in heat transfer and temperature uniformity. With the introduction of topology optimization into solid-liquid heat transfer, many researchers have used topology algorithms and presented many pioneering topological structures of MCHSs, which show extraordinary performance in flow and heat enhancement.…”

Section: Optimization Design Of Microchannel Structurementioning

confidence: 99%

A comprehensive review on microchannel heat sinks for electronics cooling

Yu,

Li,

Cao

2024

Int. J. Extrem. Manuf.

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The heat dissipation density of electronic devices is increasing dramatically, which causes a serious heat bottleneck in electronics. Operating temperature over its rated temperature results in performance deterioration and even device damage. With the development of micro-machining technologies, microchannel heat sinks have become one of the best ways to remove the considerable amount of heat generated by the high-power electronics. It shows the advantages of large specific surface area, small size, saving coolant and high heat transfer coefficient. This paper comprehensively overviews the research progress in microchannel heat sinks and generalizes the hotspots and bottlenecks of this area. The heat transfer mechanisms and performances of different channel structures, coolants, channel materials and some other influence factors are reviewed. Besides, this paper classifies the heat transfer enhancement technology and reviews the related studies on both the single-phase and phase-change flow and heat transfer. The comprehensive review is expected to provide theoretical reference and technical guidance for further research and application of microchannel heat sinks in the future.

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Section: Optimization Design Of Microchannel Structurementioning

confidence: 99%

A comprehensive review on microchannel heat sinks for electronics cooling

Yu,

Li,

Cao

2024

Int. J. Extrem. Manuf.

View full text Add to dashboard Cite

show abstract

“…66 Puers and Sansen also discussed how WCE is limiting for features produced by plane interactions, which are only stable for angles of corners less than 180°. 67 Conversely, Gaikwad 68 and Bhardwaj et al 69 highlighted Deep Reactive Ion Etch (DRIE), a recent advancement in the etch process, which is more suitable for silicon, glass, and polymers due to the requirement for low reactive energy and low manufacturing uncertainty. Importantly, the DRIE etch process can be easily masked with a variety of polymer and dielectric films like silicon dioxide and photoresist.…”

Section: Chemical Etchingmentioning

confidence: 99%

Comparative study of the parameters affecting the performance of microchannels' heat exchangers: Latest advances review

Asim

Shoaib

Uddin

et al. 2023

Energy Science & Engineering

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Microchannel heat exchangers are heat exchangers with a tube diameter of less than 1 mm. Conventional cooling approaches such as the forced‐air cooling technique fail in high technological compact systems because of the small‐sized surfaces of chips and circuits. In comparison, microchannel heat exchangers are being extensively utilized in compact‐sized devices where a high heat‐transfer medium is required. Moreover, consumers' continued desire for compact products has prompted researchers to study microchannel heat exchangers for their ability to boost the rate of heat transfer that ensures the safety of compact designs. This study presents the evaluation of performance parameters and the manufacturing aspects of microchannel heat exchangers. This study also examines how microchannel heat exchangers are affected by several parameters, including the type of working fluid used, Brownian motion, geometry of the channel, Reynolds number, Nusselt number, Knudsen number, wall resistance of the channel, the effect of gravity, and inlet and outlet arrangement for fluid. Investigating the various geometries for the microchannel indicates that the least pressure drop occurs in square shape cross‐section channels while the highest pressure drop occurs in channels with triangular cross‐sections. Moreover, it has been observed that, with the addition of nanoparticles to the working fluid, the thermal properties of the exchangers as well as the pressure drop increases while at the same time it reduces the boundary layer thickness. In addition, the Reynolds number affects the performance irrespective of the channel geometry. When the fluid is added with nanoparticles, like, Al2O3 and copper oxide (CuO) with different volumetric fractions (φ) of 0%, 0.5%, 1%, 1.5%, and 2%, the performance of the microchannel rises with rising the Reynolds number but conversely when the fluid is used in pure form the performance decreases with the rising value of Reynolds number. In addition, it has been observed that the overall improvement is obtained at φ = 2% and Re = 100 for CuO–water nanofluid. Apart from this, the least heat transfer is recorded at φ = 0.5% and Re = 1.00 for both nanofluids. Moreover, this study concludes that the Nusselt number is independent of the Reynolds number in the regime of laminar flow. It is further evident that as the nanoparticle size reduces, the Nusselt number rises when all the remaining conditions are the same. Apart from this, investigating the inlet/outlet arrangement through finite volume method for D‐, I‐, N‐, S‐, U‐, and V‐type arrangements, it is evident that the V‐type sink has overall greater performance. In terms of gravity, it is observed that it has no effect on the performance of microchannel heat exchangers. This study further illustrates the effects of the fabrication method on the performance of the microchannel heat exchangers.

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Numerical Study on Microchannel Heat Sink with Asymmetric Leaf Pattern

Cited by 2 publications

References 6 publications

A comprehensive review on microchannel heat sinks for electronics cooling

A comprehensive review on microchannel heat sinks for electronics cooling

Comparative study of the parameters affecting the performance of microchannels' heat exchangers: Latest advances review

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