2015
DOI: 10.1016/j.ijheatmasstransfer.2015.01.093
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Numerical study on temperature uniformity in a novel mini-channel heat sink with different flow field configurations

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Cited by 60 publications
(13 citation statements)
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“…A very significant part of designing heat exchangers is to choose the proper inlet and outlet manifold configuration. Numerical study where comparisons of some flow fields were made in (Mu et al 2015), and it was determined that the bifurcation structure manifold gives excellent distribution, which resulted in a very uniform temperature field over the heating surface. The numerical optimization of the flow distribution on an inlet manifold was proposed by (Chien et al 2019).…”
Section: Introductionmentioning
confidence: 99%
“…A very significant part of designing heat exchangers is to choose the proper inlet and outlet manifold configuration. Numerical study where comparisons of some flow fields were made in (Mu et al 2015), and it was determined that the bifurcation structure manifold gives excellent distribution, which resulted in a very uniform temperature field over the heating surface. The numerical optimization of the flow distribution on an inlet manifold was proposed by (Chien et al 2019).…”
Section: Introductionmentioning
confidence: 99%
“…They then merge until the creation of the main fluid stream. In paper (Mu et al, 2015), comparisons of some flow fields were made, and it was determined that the bifurcation structure (the circular turning constructal distributor) gives excellent distribution, which resulted in a very uniform temperature field over the heating surface.…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, heat dissipation technology has become the key to achieving long-life and high-reliability performance [5]. For this purpose, many effective methods have been implemented in forced convection cooling techniques, such as heat sinks cooled by air or liquid [6][7][8], microchannel pipes [9], and new materials and new technology [10][11][12]. However, the conventional air-cooled cooling systems are often inadequate to remove excessive heat from electronic components because of narrow heat dissipation space [13].…”
Section: Introductionmentioning
confidence: 99%