1998
DOI: 10.1093/oxfordjournals.jmicro.a023584
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Observation of Al surface during sputter-cleaning and annealing procedures under UHV-REM

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“…walls of fusion devices) and in device technology for optimizing semiconductor doping profiles and tailoring thin film growth [1][2][3][4][5]. In surface analysis, erosion of solid surfaces by collisional ion beam sputtering is performed to clean samples using chemically inert noble gases (NG) in ultra-high vacuum (UHV) environment [6,7].…”
Section: Introductionmentioning
confidence: 99%
“…walls of fusion devices) and in device technology for optimizing semiconductor doping profiles and tailoring thin film growth [1][2][3][4][5]. In surface analysis, erosion of solid surfaces by collisional ion beam sputtering is performed to clean samples using chemically inert noble gases (NG) in ultra-high vacuum (UHV) environment [6,7].…”
Section: Introductionmentioning
confidence: 99%