Observation of laser-induced explosion of solid materials and correlation with theory

Gagliano, F. P.; Paek, Un-Chul

doi:10.1109/jqe.1973.1077529

Cited by 3 publications

(3 citation statements)

References 2 publications

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“…We found cluded in this ablatioddamage model are the suthat for T 2 65"C, there was alteration of guinea perheating of subsurface tissue [Dabby and Peak, pjg dermis collagen fibers. The calculated initial 1972; Ready, 19631, explosive removal of tissue temperature resulting from the absorption of the [Dabby and Peak, 1972; Gagliano and Peak, 1974; COz laser radiation is greater than 65°C for ap-Prince et al, 19861, scattering of the incident raproximately 40-50 pm into the nonablated tissue, diation such as occurs with visible laser radiation suggesting that the minimum damage zone should [Jacques and Prahl, 1987;Welch et al, 19871, and be on the order of 40-50 pm in width. This esti-removal of tissue at fluences less than Fth (Walsh, mate is reasoanbly consistent with the experimen-unpublished data).…”

Section: -mentioning

confidence: 99%

Pulsed CO₂ laser tissue ablation: Effect of tissue type and pulse duration on thermal damage

Walsh¹,

Flotte²,

Anderson³

et al. 1988

Lasers Surg Med

365

133

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Tissue removal by infrared lasers is accompanied by thermal damage to nonablated tissue. The extent of thermal damage can be controlled by a choice of laser wavelength, irradiance, and exposure duration. The effect of exposure duration has been studied in vivo by using CO2 lasers with pulse widths that vary from 2 microseconds to 50 msec. Pulse widths of 50 msec, typical of a shuttered, continuous-wave CO2 laser, produce damage regions 750 micron wide in normal guinea pig skin; the use of a 2-microseconds-long pulse reduced this damage zone to as little as 50 micron. Using 2-microseconds-long pulses, in vitro studies showed that the minimum zone of thermal damage varied significantly with tissue type. The thermal denaturation of these tissues has been studied and correlated with damage. The effect of denaturation temperature and pulse duration on the width of the damage zone is explained by a simple model.

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Section: -mentioning

confidence: 99%

Pulsed CO₂ laser tissue ablation: Effect of tissue type and pulse duration on thermal damage

Walsh¹,

Flotte²,

Anderson³

et al. 1988

Lasers Surg Med

365

133

View full text Add to dashboard Cite

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“…Combined with plasma diffusion process of LTVS in Figure 8, abundant LPP can be generated immediately due to the laser materials interactions [25,26]. LPP diffuse into vacuum gap with high velocities under the accelerations of target explosions and gap electric fields [27,28]. The collisions of LPP with electrode surface would benefit to the formations of initial discharge channels in vacuum gaps, leading to the voltage fall of switch [29,30].…”

Section: Analysis On the Closing Process Of Dltvsmentioning

confidence: 99%

Closing performances of double‐gap laser‐triggered vacuum switch

et al. 2020

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To develop high-voltage-pulsed power switches with better performances, a multi-gap laser-triggered vacuum switch is proposed in this study. Based on established test prototype for double-gap laser-triggered vacuum switch, closing processes of double-gap laser-triggered vacuum switch are discussed combined with laser-produced plasma. Closing performances of double-gap laser-triggered vacuum switch under different gap polarity configurations, operating voltages, laser energies and laser split ratios are investigated. Closing time delay characteristics of double-gap laser-triggered vacuum switch and single-gap laser-triggered vacuum switch are compared later. The test results prove that, affected by the imbalanced developed initial plasma between gaps, double-gap laser-triggered vacuum switch with two positive gaps and 1:1 laser split ratio presents best closing performances than other switches. With the rise of laser energy, closing delay time and jitter time of double-gap laser-triggered vacuum switch both decrease, while the influences from increasing voltages are weak. Closing delay time of P-P type double-gap laser-triggered vacuum switch can be controlled within 103 � 1.5 ns under 90 mJ laser energy, and it is about 10 ns longer than single-gap laser-triggered vacuum switch. For some direct current applications with changing voltage directions, P-N type double-gap laser-triggered vacuum switch with 1:1 laser split ratio shows more stable closing performances. In addition, closing performances of double-gap laser-triggered vacuum switch can be further improved by optimizing the developments of initial plasma in series gaps. This is an open access article under the terms of the Creative Commons Attribution License, which permits use, distribution and reproduction in any medium, provided the original work is properly cited.

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“…In laser ablation process using pulsed laser, photons of laser are absorbed by electrons of silicon and if the supplied energy is high enough to break down the lattice, silicon will start to melt and vaporize ( Figure 42). [148][149][150] A plasma plume, consisting of loosely bound electrons and ions, is formed over the molten area. The plasma expansion and ejection of vaporized material across the Knudsen layer, which represents a region of a few microns of gasdynamic discontinuity, can cause shock waves or explosions over and underneath the ablated area.…”

Section: Laser Dicingmentioning

confidence: 99%

Ultrathin Wafer Pre-Assembly and Assembly Process Technologies: A Review

Marks

Hassan

Cheong

2015

Critical Reviews in Solid State and Materials Sciences

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Ultrathin silicon wafer technology is reviewed in terms of the semiconductor applications, critical challenges, and wafer pre-assembly and assembly process technologies and their underlying mechanisms. Mechanical backgrinding has been the standard process for wafer thinning in the semiconductor industry owing to its low cost and productivity. As the thickness requirement of wafers is reduced to below 100 mm, many challenges are being faced due to wafer/die bow, mechanical strength, wafer handling, total thickness variation (TTV), dicing, and packaging assembly. Various ultrathin wafer processing and assembly technologies have been developed to address these challenges. These include wafer carrier systems to handle ultrathin wafers; backgrinding subsurface damage and surface roughness reduction, and post-grinding treatment to increase wafer/die strength; improved wafer carrier flatness and backgrinding auto-TTV control to improve TTV; wafer dicing technologies to reduce die sidewall damage to increase die strength; and assembly methods for die pick-up, die transfer, die attachment, and wire bonding. Where applicable, current process issues and limitations, and future work needed are highlighted.

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Observation of laser-induced explosion of solid materials and correlation with theory

Cited by 3 publications

References 2 publications

Pulsed CO₂ laser tissue ablation: Effect of tissue type and pulse duration on thermal damage

Pulsed CO₂ laser tissue ablation: Effect of tissue type and pulse duration on thermal damage

Closing performances of double‐gap laser‐triggered vacuum switch

Ultrathin Wafer Pre-Assembly and Assembly Process Technologies: A Review

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Observation of laser-induced explosion of solid materials and correlation with theory

Cited by 3 publications

References 2 publications

Pulsed CO2 laser tissue ablation: Effect of tissue type and pulse duration on thermal damage

Pulsed CO2 laser tissue ablation: Effect of tissue type and pulse duration on thermal damage

Closing performances of double‐gap laser‐triggered vacuum switch

Ultrathin Wafer Pre-Assembly and Assembly Process Technologies: A Review

Contact Info

Product

Resources

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Pulsed CO₂ laser tissue ablation: Effect of tissue type and pulse duration on thermal damage

Pulsed CO₂ laser tissue ablation: Effect of tissue type and pulse duration on thermal damage