Observation of solidification and melting phenomena in metals using the electron microscope

Glicksman, M. E.; Vold, C.L.

doi:10.1016/0001-6160(67)90019-3

Cited by 44 publications

(9 citation statements)

References 2 publications

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“…Dynamic interactions of grain boundaries with stationary and moving solid-liquid interfaces were described in the 1960s by investigators using hotstage optical and electron microscopy [32][33][34][35]. In situ studies of moving solid-liquid interfaces demonstrated that persistent defects, such as grain boundaries and screw dislocations, were often responsible for initiating morphological instabilities that led to increasingly complex patterns in solidifying dilute alloys [36][37][38].…”

Section: Grain Boundary Grooves Backgroundmentioning

confidence: 99%

Measuring solid–liquid interfacial energy fields: diffusion-limited patterns

Glicksman

Ankit

2018

J Mater Sci

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The Leibniz-Reynolds transport theorem yields an omnimetric interface energy balance, i.e., one valid over all continuum length scales. The transport theorem, moreover, indicates that solid-liquid interfaces support capillary-mediated redistributions of energy capable of modulating an interface's motion-a thermodynamic phenomenon not captured by Stefan balances that exclude capillarity. Capillary energy fields affect interfacial dynamics on scales from about 10 nm to several mm. These mesoscopic fields were studied using entropy density multiphase-field simulations. Energy rate distributions were exposed and measured by simulating equilibrated solid-liquid interfaces configured as stationary grain boundary grooves (GBGs). Negative rates of energy distributed over GBGs were measured as residuals, by subtracting the linear potential distribution contributed by applied thermal gradients constraining the GBGs from the nonlinear distributions actually developed along their solid-liquid interface. Rates of interfacial cooling revealed numerically confirm independent predictions based on sharp-interface thermodynamics, variational calculus, and field theory. This study helps answer a long-standing question: What creates patterns for diffusion-limited transformations in nature and in material microstructures?

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Section: Grain Boundary Grooves Backgroundmentioning

confidence: 99%

Measuring solid–liquid interfacial energy fields: diffusion-limited patterns

Glicksman

Ankit

2018

J Mater Sci

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“…Tymczak and Ray (1990) [74] performed similar simulations and observed the same trends for Na crystals with BCC symmetry. Experimentally, Glicksman and Vold (1967) [75] found via in situ electron microscopy that thin films of Bi are faceted upon freezing, but smoothly curved during melting. Refs.…”

Section: Microstructural Pinningmentioning

confidence: 99%

Ostwald ripening of faceted Si particles in an Al-Si-Cu melt

Shahani

Xiao

Skinner

et al. 2016

Materials Science and Engineering: A

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The microstructural evolution of an Al-Si-Cu alloy during Ostwald ripening is imaged via synchrotron-based, four-dimensional (i.e., space and time resolved) X-ray tomography. Samples of composition Al-32wt%Si-15wt%Cu were annealed isothermally at 650 • C, in the two-phase solid-liquid regime, while tomographic projections were collected in situ over the course of five hours. Advances in experimental methods and computational approaches enable us to characterize the local interfacial curvatures and velocities during ripening. The sequence of three-dimensional reconstructions and interfacial shape distributions shows highly faceted Si particles in a copper-enriched liquid, that become increasingly isotropic or rounded over time. In addition, we find that the coarsening rate constant is approximately the same in the binary and ternary systems. By coupling these experimental measurements with CALPHAD modeling and ab initio molecular dynamics simulation, we assess the influence of Cu on the coarsening process. Finally, we find the unusual "pinning" of microstructure at the junction between rough and smooth interfaces and suggest a mechanism for this behavior.

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“…In-situ observation of melting and solidification processes of metallic films has been made by the use of a transmission electron microscope (TEM) in order to study grain boundary melting [1][2][3][4], microscopic morphology of a solid-liquid interface [5][6][7][8][9], melting transition [10,11], nucleation behavior of melting or solidification [6,[12][13][14][15][16] and behavior of dislocations in melting [17]. However, it can be pointed out that information on behavior of melt growth is lacking, while the melt growth has been observed by X-ray topography on crystals of Sn [18] and Al [19][20][21][22].…”

Section: Physics Abstractsmentioning

confidence: 99%

Observation of Melt Growth Process of Bi and Sn Thin Films

Sugawara

Watanabé

1993

Microsc. Microanal. Microstruct.

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Abstract. 2014 We observed melt-growth process of Bi and Sn thin films by in-situ transmission electron microscopy. After preparing the films with some specified orientations from bulk single crystals of Bi (99.9 and 99.9999 %) and Sn (99.999 %), we partially melted and regrew them by cooling at a nearly constant rate in an electron microscope. In the Bi films, a growing solid-liquid interface was observed to be concave toward melt more frequently than faceted. The movement of the curved interface was sensitive to small fluctuations of the falling temperature, while the faceted interface was insensitive. During the melt growth various crystal defects were introduced, and their density depends on the orientation, purity of films and the cooling condition. In the Sn films, a growing interface was always curved. The defects formed were confined to lineage defects, of which formation was not influenced by the cooling rate but by the film orientation.

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Observation of solidification and melting phenomena in metals using the electron microscope

Cited by 44 publications

References 2 publications

Measuring solid–liquid interfacial energy fields: diffusion-limited patterns

Measuring solid–liquid interfacial energy fields: diffusion-limited patterns

Ostwald ripening of faceted Si particles in an Al-Si-Cu melt

Observation of Melt Growth Process of Bi and Sn Thin Films

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