Oligoimide Containing 8-Hydroxyquinoline as a Pendent Group

Abstract

New ethylenebismaleimide-diamine oligoimide-II (EBMDDMCMHQ) containing 8-hydroxyquinoline as a pendent group(s) was prepared using ethylenebismaleimidediamine oligoimide-I (EBMDDM) and 5-chloromethyl-8-hydroxyquinoline hydrochloride (CMHQ) in the presence of base catalyst. Ethylenebismaleimide-diamine oligoimide-I (EBMDDM) was prepared by the Michael addition reaction of ethylenebismaleimide (EBM) and 4,4 0 -diaminodiphenyl methane (DDM). The resulting oligoimide-II (EBMDDMCMHQ) was characterized by spectral techniques. Polymeric metal chelates of oligoimide-II were prepared using transition metal ions and were duly characterized. Ion-exchange properties of oligoimide-II for Fe(III), Zn(II), Ni(II), and Cu(II) metal ions were also studied by batch-equilibration method. It has good metal ion uptake capacity at varying pH ranges.

New Polyimide and Nanoporous Structures with Low Dielectric Constant

“…[1][2][3][4][5][6][7][8][9] In electronic packaging, low dielectric materials can minimize cross talk and maximize signal propagation speed in devices. [1][2][3][4][5][6][7][8][9] In electronic packaging, low dielectric materials can minimize cross talk and maximize signal propagation speed in devices.…”

“…Aromatic polyimides (PIs) have received great attention as packaging materials and interlayer dielectrics in microelectronic industry owing to their favorable properties including high thermal stability, chemical resistance, and good mechanical and electrical properties . In electronic packaging, low dielectric materials can minimize cross talk and maximize signal propagation speed in devices.…”