Advances in Patterning Materials and Processes XXXVI 2019
DOI: 10.1117/12.2516010
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Oligomers of MORE: Molecular Organometallic Resists for EUV

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“…[61] The development of an efficient EUV MOR will solve the problems that organic EUV PR (Photoresist) faces, such as low absorption efficiency or low dry etch tolerance etc. [61][62][63][64][65][66][67][68][69][70][71][72][73][74][75] Also, the unit size of organic EUV PR is approximately 5 nm; however, by using MOR materials, the unit size can be narrowed down to approximately 1 nm, which is expected to enhance the resolution of the lithography process.…”
Section: Growth Of Importance Of Semiconductor Materialsmentioning
confidence: 99%
“…[61] The development of an efficient EUV MOR will solve the problems that organic EUV PR (Photoresist) faces, such as low absorption efficiency or low dry etch tolerance etc. [61][62][63][64][65][66][67][68][69][70][71][72][73][74][75] Also, the unit size of organic EUV PR is approximately 5 nm; however, by using MOR materials, the unit size can be narrowed down to approximately 1 nm, which is expected to enhance the resolution of the lithography process.…”
Section: Growth Of Importance Of Semiconductor Materialsmentioning
confidence: 99%