On a stochastically grain-discretised model for 2D/3D temperature mapping prediction in grinding

Abstract

Excessive grinding heat might probably lead to unwanted heat damages of workpiece materials, most previous studies on grinding heat/temperature, however, assumed the wheel-workpiece contact zone as a moving band heat source, which might be not appropriate enough to capture the realistic situation in grinding. To address this, grinding temperature domain has been theoretically modeled in this paper by using a stochastically grain-discretised temperature model (SGDTM) with the consideration of grain-workpiece micro interactions (i.e. rubbing, ploughing and cutting), and the full 2D/3D temperature maps with highly-localised thermal information, even at the grain scale (i.e. with the thermal impacts induced by each individual grain), has been presented for the first time. To validate theoretical maps, a new methodological approach to capture 2D/3D temperature maps based on an array of sacrificial thermocouples have also been proposed. Experimental validation has indicated that the grinding temperature calculated by SGDTM showed a reasonable agreement with the experimental one in terms of both 1D temperature signals (i.e. the signals that are captured at a specific location within the grinding zone) and the 2D/3D temperature maps of the grinding zone, proving the feasibility and the accuracy of SGDTM. This study has also proved that, as expected, the heat fluxes are neither uniformly-distributed along the wheel width direction nor continuous along the workpiece feed direction. The proposed SGDTM and the temperature measurement technique are not only anticipated to be powerful to provide the basis for the prevention of grinding thermal damage (e.g. grinding burns, grinding annealing and rehardening), but also expected to be meaningful to enhance the existing understanding of grinding heat/temperature than using the common approach depending on the single thermocouple technique.

Approach to the numerical modelling of the chip temperatures in single grain scratching

“…Li and Axinte [8] developed a temperature model in which the three phases of chip formation were integrated. The thermal impact caused by the individual grains on the workpiece (AISI 1055) was simulated.…”

Research on variation of grinding temperature of wind turbine blade robotic grinding

“…Where h is the grinding depth at any grinding point; A is the contact area of the grinding contact area; e ch is the limit abrasive debris energy, 21 and its expression is shown in equation (15)…”

On the inverse design of discontinuous abrasive surface to lower friction-induced temperature in grinding: An example of engineered abrasive tools

“…Previous grinding temperature models assumed the heat flux within the tool-workpiece contact zone as uniform along the contact width [3]. However, this assumption obviously cannot apply for the tools with PGA as these engineered abrasive tools lead to continuous change of the tool-workpiece contact width (see different widths in cross section 1 to 3 in Fig.…”

“…Although the morphology of the abrasive tool surfaces are discontinuous at microscale (grains, binder and porosities discretely and randomly distributed), the limited micro gaps between neighboring grains are found insufficient to provide enough grain-materialdisengagement period and coolant reservoir space to cool down the tool-workpiece material contact zone [2]. High temperature and the corresponding workpiece thermal damage (manifested as heat affected zones) caused by intensive cutting parameters therefore, is treated as one of the toughest issues in abrasive processes [3].…”