On-Chip Coupled Transmission Line Modeling for Millimeter-Wave Applications Using Four-Port Measurements

Kang, Kai; Brinkhoff, James; Shi, Jinglin; Lin, Fujiang

doi:10.1109/tadvp.2009.2024212

Cited by 25 publications

(2 citation statements)

References 21 publications

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“…Hence, in (5) can predict intensity of signal at a given point. However, loss 𝜎 and intensity of the received signal share inverse relationship between eachother (7) [2], using substitution and logarithmic technique, loss is expressed as ( 8) and ( 9):…”

Section: Proposed Wireline Channel Modelmentioning

confidence: 99%

“…The line loss causes another low pass signal filtering, and more negative impacts from short traces (such as vias, connector, and traces) linking electronic components together. Many authors have attempted and proposed nomograms and channel/transmission line models for appropriate expected signal level prediction in chip-to-chip, system in package links [2]- [9]. Several works have been done on electrical simulation of interconnects with various techniques developed, such as resistance-capacitance (RC) tree interconnect representation, and two-pole approximation technique [10], [11].…”

Section: Introductionmentioning

confidence: 99%

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Transmission line characterization and modeling for electronic circuits and systems design

Famoriji

Shongwe

2023

IJEECS

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Channel bandwidth-limited high-speed links or interfaces make circuit solutions not efficient. Both recent and subsequent links (SerDes-Serializer/Deserializer) design demand efficient and effective coupling between future circuit design, communication, and optimization. The challenges vary and new solutions are needed. In this article, an analytical wireline model is presented to predict electronic path loss towards adequate designs of electronic circuits and systems. An open loop system analysis is adapted in this paper. Our model was tested against different channels: a legacy channel with via stub discontinuity and FR4 dielectric, and a more recent microwave-engineered channel without stub and NELCO 6,000 dielectric, a very good matching attained. Good agreement was observed between our model and electromagnetic full-wave simulation data, as a result showed high level of applicability to thin-film microstrip line for adequate circuit design. The model is recommended for electronic engineers for adequate and faster interfaces and high-speed links designs.

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Section: Proposed Wireline Channel Modelmentioning

confidence: 99%