Eleventh IEEE European Test Symposium (ETS'06)
DOI: 10.1109/ets.2006.34
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On-Chip Evaluation, Compensation, and Storage of Scan Diagnosis Data - A Test Time Efficient Scan Diagnosis Architecture

Abstract: Technology and product ramp up suffers increasingly from systematic production defects.

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Cited by 8 publications
(6 citation statements)
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References 12 publications
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“…In multi-site testing, many dies on a load-board or even on a wafer are tested in parallel by the same ATE [1], [2], [3], [4], [5]. All the dies receive identical input by the ATE, but the output side of the die-under-test cannot be handled in the same straightforward way, as the defective dies will respond in many different, unpredictable ways.…”
Section: Introductionmentioning
confidence: 99%
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“…In multi-site testing, many dies on a load-board or even on a wafer are tested in parallel by the same ATE [1], [2], [3], [4], [5]. All the dies receive identical input by the ATE, but the output side of the die-under-test cannot be handled in the same straightforward way, as the defective dies will respond in many different, unpredictable ways.…”
Section: Introductionmentioning
confidence: 99%
“…One solution is feeding all the dies with the correct output by the ATE, equipping them with an on-chip comparator and comparing the expected and computed response on chip (figure 1). In a small on-chip memory the indices of the first n failing vectors or bits are stored and evaluated die by die [1], [6]. Throughput requirements and test application time are reduced, if each die is equipped with test data decompression and test response compaction logic (figure 2) [1].…”
Section: Introductionmentioning
confidence: 99%
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“…Bandwidth reduction is one of the major concerns for multisite testing [1,2]. Reducing bandwidth on the output side affects input side bandwidth, if fault coverage and diagnostic resolution should be maintained.…”
Section: Introductionmentioning
confidence: 99%
“…The latter is important since unspecified bits in the PR are becoming more common with technology scaling. A similar approach with a mechanism for masking unspecified values has been proposed for different purpose [12]. The scan chains, a to d in c 1 and e to g in c 2 , are partitioned into wrapper chains that are connected to six TAM wires, TAM 1 to TAM 6 .…”
Section: Sharingmentioning
confidence: 99%