On-chip high speed localized cooling using superlattice microrefrigerators

Abstract

Abstract-In this paper, we addressed heating problems in integrated circuits (ICs) and proposed a thin-film thermionic cooling solution using Si/SiGe superlattice microrefrigerators. We compared our technology with the current most common solution, thermoelectric coolers, by strengthening the advantages of its compatible fabrication process as ICs for easy integration, small footprint in the order of 100 100 m 2 , high cooling power density, 600 W/cm 2 and fast transient response less than 40 s. The thermoreflectance imaging also demonstrated its localized cooling. All these features combined together to make these microrefrigerators a very promising application for on-chip temperature control, removing hot spots inside IC.

Formation of Bismuth Nanocrystals in Bi2O3Thin Films Grown at 300 K by Pulsed Laser Deposition for Thermoelectric Applications

“…1,2 Compared with conventional mechanical devices, thermoelectric devices have the advantage of being maintenance-free and with a better transient response. 3,4 The predominant technology for miniaturizing thermoelectric devices is to apply semiconductor-processing technologies that include thin film fabrication. For the evaluation of the thermoelectric performances of thermoelectric devices, their efficiencies can usually be quantified by a dimensionless figure of merit (ZT), ZT = S 2 T/ρκ, where S is the Seebeck coefficient, T is the absolute temperature, ρ is the electrical resistivity, and κ is the total thermal conductivity.…”

Nanowire Applications: Thermoelectric Cooling and Energy Harvesting

“…This is larger than that of Si/Si x Ge 1-x thin film cooler (Y. Zhang et al, 2006) which is 36%, and larger than that of commercial TE module which is only 0.1%. (Rowe 2006) From the analytical expression of cooling temperature, we can provide a prediction of the transverse size effect on the cooling temperature.…”

“…Fan et al, 2001), ten times larger than that of Si/Si x Ge 1-x thin film cooler (Y. Zhang et al, 2006), and six hundred times larger than that of commercial TE module. (Rowe 2006) The performance of any thermoelectric material is in general expressed by its coefficient of performance (COP).…”

Special Heat Transfer Mechanisms: Active and Passive Thermal Diodes

“…Furthermore, researchers have also developed thin-film thermionic cooling devices (especially HIT devices). These micro devices work at/ near room temperature with high cooling-power densities (600 Wm −2 , temperature span 4.1 K) [26][27][28][29] and with fast response times (40 μs) [30], which is used in high-speed micro on-spot cooling.…”