2024
DOI: 10.1007/s40820-024-01342-3
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On-Chip Micro Temperature Controllers Based on Freestanding Thermoelectric Nano Films for Low-Power Electronics

Qun Jin,
Tianxiao Guo,
Nicolás Pérez
et al.

Abstract: Multidimensional integration and multifunctional component assembly have been greatly explored in recent years to extend Moore’s Law of modern microelectronics. However, this inevitably exacerbates the inhomogeneity of temperature distribution in microsystems, making precise temperature control for electronic components extremely challenging. Herein, we report an on-chip micro temperature controller including a pair of thermoelectric legs with a total area of 50 × 50 μm2, which are fabricated from dense and fl… Show more

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Cited by 7 publications
(2 citation statements)
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“…The accumulation of heat in electronic circuits can adversely affect device performance and reduce their lifespan . To address this problem, thermal management technologies have been developed for use in applications like supercomputing and electric vehicles to enhance device performance and longevity. Within this context, TIMs play a crucial role in extending device lifespan. TIMs are a key component of effective thermal management, designed to transmit heat from circuits to the surrounding environment by filling the unavoidable air gaps between heat-generating devices and their radiator contact surfaces. TIMs come in different forms, including thermal pads, thermal greases, thermal gels, and TCAs, depending on their encapsulation state and application method. ,, Compared to other TIMs, TCAs are more suitable for thermal management due to their versatility. Typically, TCAs are created by mixing thermal fillers with a polymer matrix.…”
Section: Introductionmentioning
confidence: 99%
“…The accumulation of heat in electronic circuits can adversely affect device performance and reduce their lifespan . To address this problem, thermal management technologies have been developed for use in applications like supercomputing and electric vehicles to enhance device performance and longevity. Within this context, TIMs play a crucial role in extending device lifespan. TIMs are a key component of effective thermal management, designed to transmit heat from circuits to the surrounding environment by filling the unavoidable air gaps between heat-generating devices and their radiator contact surfaces. TIMs come in different forms, including thermal pads, thermal greases, thermal gels, and TCAs, depending on their encapsulation state and application method. ,, Compared to other TIMs, TCAs are more suitable for thermal management due to their versatility. Typically, TCAs are created by mixing thermal fillers with a polymer matrix.…”
Section: Introductionmentioning
confidence: 99%
“…In power semiconductor devices and modules, such as insulated gate bipolar transistors (IGBTs) and metal-oxide-semiconductor field-effect transistors (MOSFETs), thermal stress arises from the operation and dissipation of heat during switching events and continuous operation [ 7 , 8 , 9 , 10 , 11 , 12 ]. The cyclic nature of these temperature fluctuations subjects thin films within the devices to mechanical strain, leading to fatigue-related phenomena [ 13 ].…”
Section: Introductionmentioning
confidence: 99%