On-chip patch antenna on InP substrate for short-range wireless communication at 140 GHz

Abstract

This paper presents the design of an on-chip patch antenna on indium phosphide (InP) substrate for short-range wireless communication at 140 GHz. The antenna shows a simulated gain of 5.3 dBi with 23% bandwidth at 140 GHz and it can be used for either direct chip-to-chip communication or chip-level integration and packaging. In the transmission frequency band from 130 GHz to 150 GHz the estimated inband gain variation is 0.5 dBi which guarantees gain uniformity. The antenna with optimized dimension is implemented for a transition between elevated coplanar waveguide (ECPW) and rectangular waveguide. The chip-to-waveguide transition in backto-back configuration exhibits a simulated return loss of 10 dB and insertion loss of 3 dB from 128 GHz to 153 GHz. For higher directivity, a horn antenna is used together with the chip-towaveguide transition forming an extended packaging structure that is suitable for the transceiver (Tx and Rx) chips. The simulated gain of the extended packaging structure is 11.9 dBi with 21.4% bandwidth at 140 GHz and the in-band gain variation is 2 dBi.

A Review of Design and Integration Technologies for D-Band Antennas

“…For example, a 60 GHz InP-based cavity-backed slot antenna presented in [102] achieved a simulated efficiency of over 90%. In [103] and [104], low-loss WGL have been demonstrated on InP and GaAs technologies, respectively. The more efficient antenna and interconnects can lead to fewer amplifier stages for a specified power output.…”